Senior Dry Etch Process Engineer - Yield & Innovation

Peoplebank Hong Kong Limited; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

Client in Singapore seeks a Senior Process Engineer (Dry Etch) to develop, optimize, and sustain Plasma/Dry Etch processes in a high-volume wafer fab. You will drive process capability, yield, and equipment performance while supporting new technology development.

Responsibilities include troubleshooting, root cause analysis, and implementing corrective actions to improve process stability; leveraging SPC and DOE for continuous optimization and cross-functional tech transfers.

Qualifications

• Bachelor's degree in Engineering, Physics, Materials Science, or related discipline.
• 3+ years of semiconductor process engineering experience in Plasma Etch or Dry Etch.
• Strong knowledge of semiconductor fabrication processes, SPC, DOE, and failure analysis techniques.
• Hands-on experience with process optimization, troubleshooting, and yield improvement.

Responsibilities

• Develop, optimize, and sustain Plasma Etch / Dry Etch processes to meet production targets.
• Troubleshoot process and equipment issues; perform root cause analysis and corrective actions.
• Utilize SPC, DOE, and data analysis to drive yield improvement and process optimization.
• Collaborate with cross-functional teams for technology transfers and continuous improvement.

Skills

Plasma Dry Etch

SPC (Statistical Process Control)

DOE (Design of Experiments)

Data Analysis

Yield Improvement

Education

Bachelor's Degree in Engineering, Physics, Materials Science, or related discipline

Job description

Client in Singapore seeks a Senior Process Engineer (Dry Etch) to develop, optimize, and sustain Plasma/Dry Etch processes in a high-volume wafer fab. You will drive process capability, yield, and equipment performance while supporting new technology development.

Responsibilities include troubleshooting, root cause analysis, and implementing corrective actions to improve process stability; leveraging SPC and DOE for continuous optimization and cross-functional tech transfers.