Lead Dry Etch Process Engineer – Global Yield & Innovation

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a Principal Engineer for FE OCT CPEE HVM Dry Etch. Lead productivity and yield initiatives across Dry Etch modules, coordinating with global sites to optimize chamber performance and process parameters.

You will advance CIP roadmaps, partner with suppliers, and drive safety, efficiency, and sustainability while enabling AI-enabled insights for process optimization.

Qualifications

• Bachelor's or Master's degree in Engineering (Chemical, Electrical, Materials) or related field.
• Extensive experience in semiconductor equipment and process management in Dry Etch.
• Proven track record in maturing tool performance and establishing plasma process parameters.

Responsibilities

• Lead productivity, yield, quality, and cost improvement engagements across Dry Etch modules.
• Collaborate with cross-functional teams to reduce defects and optimize chamber performance.
• Develop CIP roadmaps, upgrade safety, and drive tool efficiency with suppliers.

Skills

Dry etch expertise

Tool performance maturation

FDC/SPC analysis

Safety & sustainability

Education

Bachelor's/Master's in Engineering or related field

Tools

LAM Kiyo

Flex

Vantex

Versys

TEL Tactras

AMAT Sym3/Centura

Job description

Micron Technology, Inc. in Singapore is seeking a Principal Engineer for FE OCT CPEE HVM Dry Etch. Lead productivity and yield initiatives across Dry Etch modules, coordinating with global sites to optimize chamber performance and process parameters.

You will advance CIP roadmaps, partner with suppliers, and drive safety, efficiency, and sustainability while enabling AI-enabled insights for process optimization.