Senior Design Engineer, RD Product Design & Packaging

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

ams OSRAM Asia Pacific Pte. Ltd. is seeking a Senior Staff Engineer to lead RD product design for sensing modules in Singapore.

You will create 3D models and 2D drawings, drive substrate and flex design, and coordinate PCBA layouts and bonding diagrams throughout the development cycle. The role requires strong CAD skills (SolidWorks, AutoCAD), PCB routing experience (Altium/Cadence), and the ability to perform FEA/CFD simulations.

Qualifications

• Degree/Masters in Mechanical and/or Electrical and/or Mechatronics Engineering.
• Proficiency in SolidWorks and AutoCAD is a must.
• Experience in Altium/Cadence for PCB test board routing and substrate/flex design knowledge.
• Experience in die attach, wirebond, packaging in transfer or compression molding tech is a plus.
• Knowledge of COMSOL or equivalent and ability to conduct FEA/CFD simulations is a plus.

Responsibilities

• Designer of modules for consumer, industrial and automotive sensing markets; conduct design assessments (feasibility, concept, risks).
• Create 3D models and 2D drawings using SolidWorks/AutoCAD.
• Responsible for substrate & flex design, PCBA design and bonding diagrams; other mechanical parts as needed.
• Define CTQ, generate FAI/SPC tables, and specify components and tapes for project fabrication.
• Lead design reviews and provide DFM feedback based on tolerances and vendor capabilities.
• Collaborate with cross-functional teams to ensure on-time build deliveries.

Skills

SolidWorks

AutoCAD

PCB routing

FEA/CFD

COMSOL

Education

Degree/Masters in Mechanical/Electrical/Mechatronics

Tools

Altium

Cadence

COMSOL

Job description

ams OSRAM Asia Pacific Pte. Ltd. is seeking a Senior Staff Engineer to lead RD product design for sensing modules in Singapore.

You will create 3D models and 2D drawings, drive substrate and flex design, and coordinate PCBA layouts and bonding diagrams throughout the development cycle. The role requires strong CAD skills (SolidWorks, AutoCAD), PCB routing experience (Altium/Cadence), and the ability to perform FEA/CFD simulations.