Staff Engineer, RD Product Design

Ams Osram; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

Ams Osram LSPLight Sensors & Power Solutions division develops sensors for consumer, industrial and automotive markets, converting physical signals into data so machines can interact with people. This role contributes to innovative sensor solutions that push the boundaries of technology.

You will design modules, create 3D models and drawings, and work with cross-functional teams to ensure quality, manufacturability and on-time delivery across projects.

Qualifications

• Degree/Master’s in Mechanical and/or Electrical and/or Mechatronics Engineering.
• Proficiency in SolidWorks and AutoCAD is a must.
• Experience with Altium/Cadence for PCB routing and substrate/FPC design knowledge.
• Experience in die attach, wirebond and packaging in transfer/compression molding is a plus.
• Knowledge of COMSOL and ability to run FEA/CFD simulations is a plus.

Responsibilities

• Designer of modules for consumer, industrial and automotive sensing markets and design assessment (feasibility, concept, risks).
• Deep knowledge in SolidWorks and AutoCAD; create 3D models and 2D drawings.
• Responsible for substrate & flex design, PCBA design and bonding drawings and other mechanical parts.
• Define CTQ and produce FAI/SPC tables and set technical specifications for components.
• Lead design reviews and provide DFM feedback based on design tolerance analysis and vendor capabilities.
• Collaborate with cross functional teams to ensure builds meet project schedules.

Skills

Module design

SolidWorks

AutoCAD

PCB routing (Altium/Cadence)

Substrate/FPC design knowledge

Die attach & wirebond experience

DFM/DFx knowledge

FEA/CFD simulations (COMSOL)

Education

Degree/Masters in Mechanical and/or Electrical and/or Mechatronics Engineering

Tools

SolidWorks

AutoCAD

Altium/Cadence

COMSOL

Job description

The LSPLight Sensors & Power Solutions division supplies sensors that bridge the gap between the world we live in and the digital world of machines. By converting physical signals – heartbeats, sounds, light waves – into data, we enable robots, cars and other devices to interact with people and improve our world. What drives CSA is a relentless desire to contribute to technology and have a meaningful impact on the world. This business thrives on solving complex problems and partnering with global leaders at the forefront of technological advancement. Our goal: to push the boundaries of sensor technology and empower innovators to make the world smarter, healthier and happier.

Responsibilities

• Designer of module developed for consumer, industrial and automotive sensing market and conduct design assessment (feasibility, concept, risks) for all new product design product.
• Deep knowledge in Solidworks and AutoCAD (or any other equivalent) Software and is able to create 3D model, 2D drawing
• Responsible for substrate & flex design, PCBA design and bonding diagram/drawing and other mechanical part designs like molded lids, spacer, metal can, glass design etc. when project necessary
• Ability to list out the CTQ of product and come out FAI/SPC table for part & assembly fabrication and work out technical specifications (TS) for components like substrate, protective liner, product tape and reel by project.
• Leading design review for internal and external customer’s design and provide DFM feedback/suggestion based on design tolerance analysis, vendor’s DFM and in-house process manufacturing capabilities.
• Work closely with cross functional teams such as product engineering, process engineering, IQC, SQE, APQ, and OQC team during product development phase to ensure the build deliveries per project schedule.

Qualifications

• Degree/Masters in Mechanical and/or Electrical and/or Mechatronics Engineering
• Proficiency in SolidWorks and AutoCAD is a must.
• Experience in Altium/Cadence for PCB test board routing (electrical background) design would be a plus point with substrate and flex printed circuit (FPC) design knowledge
• Experience in die attach, wirebond process, wirebond encapsulation and packaging in transfer molding or compression molding technology would be plus point.
• Knowledge of COMSOL (or any equivalent software) and ability to conduct FEA and/or CFD simulations is a plus.