Semiconductor Packaging QA Engineer – Process Quality

SILICON BOX

Singapore

Vor Ort

SGD 70.000 - 100.000

Vollzeit

vor 4 Stunden
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Eine vollständige Bewerbung in einer Minute

Maßgeschneiderter Lebenslauf und Anschreiben – versandbereit.

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Zusammenfassung

SILICON BOX in Singapore seeks a QA Engineer (Process Quality Control) to develop and deploy inspection procedures ensuring material conformance for release. The role focuses on backend semiconductor packaging processes such as ball drop, bumping, singulation, backgrind and mounting.

You will analyze process data, drive improvements, support production targets and participate in audits. A mechanical/electrical/materials engineering background and 3–5 years of related experience are preferred for

Qualifikationen

  • Bachelor's degree in engineering (Mechanical/Electrical/Materials/Chemical or related).
  • 3–5 years experience in semiconductor packaging (ball drop, bumping, singulation, backgrind, mounting).
  • Experience in process engineering, yield improvement, and quality control.
  • Proficiency in data analysis and SPC.
  • Familiarity with FMEA, Control Plan, and Process Control documentation.
  • Hands-on experience with evaluations of new product/material/processes.
  • Ability to work in a fast-paced manufacturing environment.

Aufgaben

  • Develop and deploy inspection procedures for conformance of materials.
  • Provide engineering support to meet production output and quality goals.
  • Analyze process data and drive improvement actions.
  • Drive permanent solutions to chronic process and quality issues.
  • Evaluate new product/material/process during pilot runs.
  • Maintain relevance of Work Instructions, Control Plans, FMEA & Process Control docs.
  • Prepare line for internal and external audits and follow-up actions.
  • Perform other ad-hoc duties as assigned.

Ausbildung

Bachelor's Degree in Engineering (Mechanical, Electrical, Materials, Chemical, or related field)

Jobbeschreibung

SILICON BOX in Singapore seeks a QA Engineer (Process Quality Control) to develop and deploy inspection procedures ensuring material conformance for release. The role focuses on backend semiconductor packaging processes such as ball drop, bumping, singulation, backgrind and mounting.

You will analyze process data, drive improvements, support production targets and participate in audits. A mechanical/electrical/materials engineering background and 3–5 years of related experience are preferred for

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