Process Quality Control Engineer

SILICON BOX; Singapore; Vor Ort; SGD 70.000 - 100.000; Vollzeit

Zusammenfassung

SILICON BOX in Singapore seeks a QA Engineer (Process Quality Control) to develop and deploy inspection procedures ensuring material conformance for release. The role focuses on backend semiconductor packaging processes such as ball drop, bumping, singulation, backgrind and mounting.

You will analyze process data, drive improvements, support production targets and participate in audits. A mechanical/electrical/materials engineering background and 3–5 years of related experience are preferred for

Qualifikationen

• Bachelor's degree in engineering (Mechanical/Electrical/Materials/Chemical or related).
• 3–5 years experience in semiconductor packaging (ball drop, bumping, singulation, backgrind, mounting).
• Experience in process engineering, yield improvement, and quality control.
• Proficiency in data analysis and SPC.
• Familiarity with FMEA, Control Plan, and Process Control documentation.
• Hands-on experience with evaluations of new product/material/processes.
• Ability to work in a fast-paced manufacturing environment.

Aufgaben

• Develop and deploy inspection procedures for conformance of materials.
• Provide engineering support to meet production output and quality goals.
• Analyze process data and drive improvement actions.
• Drive permanent solutions to chronic process and quality issues.
• Evaluate new product/material/process during pilot runs.
• Maintain relevance of Work Instructions, Control Plans, FMEA & Process Control docs.
• Prepare line for internal and external audits and follow-up actions.
• Perform other ad-hoc duties as assigned.

Ausbildung

Bachelor's Degree in Engineering (Mechanical, Electrical, Materials, Chemical, or related field)

Jobbeschreibung

QA Engineer (Process Quality Control)

is responsible to develop & deploy inspection procedures to ensure conformance of material to be released. Candidates with experience in semiconductor manufacturing environment are encouraged to apply for this position.

Key Responsibilities:

• Responsible for backend semiconductor packaging processes which ball drop, bumping, singulation, backgrind and mounting.
• Effectively providing engineering support in order to meet production output, product quality, efficiency, productivity, yield, cycle time and safety requirements.
• Responsible to analyse the process data and identify improvement actions and work on the improvement.
• Drive permanent solutions to resolve chronic process and quality issues.
• Responsible to evaluate new product/material/process during the pilot run and ensure process readiness.
• Responsible for the relevance of the Work Instructions, Control Plan, FMEA & Process Control documents.
• Responsible to prepare the line for internal & external audits and the follow-up actions.
• Any other ad-hoc duties as assigned.

Requirements:

• Bachelor’s Degree in Engineering (Mechanical, Electrical, Materials, Chemical, or related field).
• Minimum 3 to 5 years of experience in semiconductor packaging processes (ball drop, bumping, singulation, backgrind, mounting) would be advantageous.
• Experience in process engineering, yield improvement, and quality control.
• Proficiency in data analysis and statistical process control (SPC).
• Familiarity with Failure Mode and Effects Analysis (FMEA), Control Plan, and Process Control documentation.
• Hands-on experience with new product/material/process evaluations.
• Ability to work in a fast-paced manufacturing environment.