R&D Engineer: Plating & Wet Etch for Advanced Packaging

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking an engineer to research, develop and qualify next-generation electroplating technologies for advanced packaging, including Cu pillar and micro-bump processes.

You will establish plating process windows, evaluate new chemistries and equipment, and drive solutions from early R&D to pilot-line qualification. You will work on process development, material and equipment qualification, and technology transfer, while leading customer development programs

Qualifications

• Bachelor's degree or higher in engineering or science.
• Three years of R&D or mass production experience in plating, etching, or stripping.
• Fundamental understanding of advanced semiconductor fabrication processes.
• Strong skills in experimental design, data analysis and technical reporting.
• Ability to prepare technical documents and deliver presentations.
• Proficiency in reading and writing technical documents in English.
• Basic knowledge of equipment and materials used in semiconductor processes.

Responsibilities

• Plating/Wet Process development for Adv. PKG product.
• New Material, Chemistry & Equipment Development and Qualification.
• Lead assigned Customer Development program.
• Defect Analysis & Failure Analysis (FA).
• Technology Transfer & Documentation.

Skills

Plating

Etching

Stripping

Experimental design

Data analysis

Technical reporting

Technical documentation

Presentations

English reading/writing

Semiconductor processes knowledge

Education

Bachelor's degree or higher in engineering or science

Job description

STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking an engineer to research, develop and qualify next-generation electroplating technologies for advanced packaging, including Cu pillar and micro-bump processes.

You will establish plating process windows, evaluate new chemistries and equipment, and drive solutions from early R&D to pilot-line qualification. You will work on process development, material and equipment qualification, and technology transfer, while leading customer development programs