Electroplating & Wet Process Engineer

UTAC; Singapore; On-site; SGD 66,960 - 100,440; Full time

Job summary

UTAC Singapore seeks a skilled process engineer to develop, optimize, and sustain electroplating and related wet processes in a cleanroom environment. You will lead DOE studies, qualification of new chemistries or equipment, and drive yield improvement through robust process control.

Collaborating with Quality, Production and R&D, you will resolve process issues, maintain SOPs and control plans, and ensure safety and environmental compliance across facilities.

Qualifications

• Strong analytical, documentation, and problem-solving skills.
• Experience with chemical wet processes or plating chemistry is preferred.
• Familiarity with SPC, DOE, FMEA and root-cause analysis tools.

Responsibilities

• Develop, implement, and optimize electroplating processes (Cu, Ni, SnAg).
• Monitor plating bath performance and take corrective actions.
• Lead DOE, capability studies, and process qualification for new chemistries/equipment.
• Troubleshoot plating defects (voids, roughness, nodules, non-uniformity, adhesion).
• Establish and maintain process parameters, SOPs, and control plans.
• Support wet processing (etching, cleaning, stripping) with stable etch rates.

Skills

Analytical skills

Documentation skills

Problem-solving

Education

Bachelor's degree in Chemical/Materials/Chemistry

Tools

SPC

DOE

FMEA

Job description

UTAC Singapore seeks a skilled process engineer to develop, optimize, and sustain electroplating and related wet processes in a cleanroom environment. You will lead DOE studies, qualification of new chemistries or equipment, and drive yield improvement through robust process control.

Collaborating with Quality, Production and R&D, you will resolve process issues, maintain SOPs and control plans, and ensure safety and environmental compliance across facilities.