R&D Engineer: Plating & Wet Etch for Advanced Packaging

PEOPLE PROFILERS PTE. LTD.; Singapore; On-site; SGD 61,000 - 73,000; Full time

Job summary

People Profilers Pte Ltd in Singapore seeks an experienced R&D engineer to research, develop and qualify next-generation electroplating technologies, including fine-pitch RDL, Cu pillar and micro-bump. You will establish plating process windows, evaluate new chemistries and equipment, and drive concepts to pilot-line qualification.

The role covers plating/wet process development for Advanced Packaging products, materials and equipment development, and leading customer development programs.

Qualifications

• Bachelor’s degree or higher in engineering or science (e.g., Material Science, Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)
• R&D or mass production experience in plating, etching, or stripping (≥3 years).
• Fundamental understanding of advanced semiconductor fabrication processes.
• Strong skills in experimental design, data analysis and technical reporting.
• Ability to prepare technical documents and deliver presentations.
• Proficiency in reading and writing technical documents in English.

Responsibilities

• Research, develop, and qualify next-generation electroplating technologies (fine-pitch RDL, Cu pillar, micro-bump).
• Establish robust plating process windows, evaluate new chemistry and equipment; drive from concept to pilot-line qualification.
• Plating/wet process development for Advanced Packaging products.
• Develop and qualify new materials, chemistries and equipment.
• Lead assigned customer development programs.
• Perform defect analysis & failure analysis; support technology transfer and documentation.

Skills

R&D experience

Mass production experience

Plating

Etching

Stripping

Experimental design

Data analysis

Technical reporting

English writing

Education

Bachelor’s degree or higher in engineering or science

Job description

People Profilers Pte Ltd in Singapore seeks an experienced R&D engineer to research, develop and qualify next-generation electroplating technologies, including fine-pitch RDL, Cu pillar and micro-bump. You will establish plating process windows, evaluate new chemistries and equipment, and drive concepts to pilot-line qualification.

The role covers plating/wet process development for Advanced Packaging products, materials and equipment development, and leading customer development programs.