Lead Photolithography Process Engineer

STATS CHIPPAC MANAGEMENT PTE. LTD.

Singapore

On-site

SGD 60,000 - 90,000

Full time

14 days+

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Job summary

STATS CHIPPAC MANAGEMENT PTE. LTD. in Singapore seeks a driven engineer to design, qualify, and optimize advanced lithography processes that meet design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery.

You will lead projects, evaluate equipment and materials, develop and qualify lithography processes, transfer technology, and work across functions to improve yield and resolve technical issues for semiconductor packaging solutions.

Qualifications

  • Bachelor's degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced Materials
  • Minimum 3 years hand-on experience in process development for photolithography
  • In-depth knowledge and on hand experience of lithographic techniques, photoresist chemistry, and exposure systems
  • Proficiency in data analysis tools (e.g., JMP, MATLAB, Excel)
  • Strong analytical and problem-solving skills
  • Excellent communication and teamwork abilities
  • Strong ability to drive actions and solutions through cross-functional teams
  • Experience in customer-driven development programs, customer qualification, and technical issue resolution for semiconductor packaging solutions

Responsibilities

  • Lead assigned projects
  • Equipment & Material Evaluation
  • Photolithography Process Development & Optimization
  • Technology Qualification & Transfer
  • Yield Improvement & Yield Failure Analysis (FA)

Skills

Analytical skills
Problem solving
Communication
Teamwork

Education

Bachelor's degree in engineering

Tools

JMP
MATLAB
Excel

Job description

STATS CHIPPAC MANAGEMENT PTE. LTD. in Singapore seeks a driven engineer to design, qualify, and optimize advanced lithography processes that meet design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery.

You will lead projects, evaluate equipment and materials, develop and qualify lithography processes, transfer technology, and work across functions to improve yield and resolve technical issues for semiconductor packaging solutions.

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