Process Engineering Manager (Electroplating)

WhiteCrow Research Pvt. Ltd.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

WhiteCrow Research Pvt. Ltd. in Singapore is seeking a Process Engineering Manager (Electroplating) to lead engineers, define methods, and apply advanced technologies to characterize hardware across our product range.

You will drive process development projects, collaborate with customers, implement new analytics, mentor teams, perform root cause analysis, and prepare technical reports and specifications for integrated products.

Qualifications

• Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.
• 8+ years of semiconductor process engineering experience with hands-on electroplating/electrochemical deposition.
• Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging.

Responsibilities

• Managing engineers in utilizing techniques to characterize hardware, defining methods and new technologies and applying them to characterize hardware, and/or performing hardware characterization on significantly complex systems for entire range of products
• Managing, developing, planning and executing process engineering projects for entire range of products
• Interacting with key customers to resolve significantly complex process engineering issues for entire range of products
• Developing and implementing new technology, products and analytical instrumentation
• Training, defining and implementing new methodologies, defining and applying new technologies, and/or troubleshoot, performing Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products
• Generating internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validating process engineering specifications for integrated products
• Contributing to market share gains through technology improvement.

Skills

Electroplating

Process Engineering

Leadership

Analytical skills

Technical communication

Education

Bachelor's/Master's/PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering or related field

Job description

We are global talent research, insight and pipelining specialists with offices in the UK, USA, Singapore, Malaysia, Hong Kong, Dubai, and India. Our international reach has helped us to understand and penetrate specialist markets at a global level. In addition to this, our service is also extended to complement our client's in-house research.

About our client

Our client is a global leader in materials engineering solutions that form the foundation of virtually every new semiconductor and advanced display technology worldwide. Their innovations play a critical role in advancing AI and accelerating the commercialization of next-generation chips.

For over 55 years, the organization has been driving technological progress through breakthrough innovations that impact billions of lives globally. Powered by some of the world's brightest visionaries, engineers, and scientists, the company brings together diverse perspectives and expertise to deliver material innovations that are shaping the future of technology.

As a Process Engineering Manager (Electroplating), you will be responsible for...

• Managing engineers in utilizing techniques to characterize hardware, defining methods and new technologies and applying them to characterize hardware, and/or performing hardware characterization on significantly complex systems for entire range of products
• Managing, developing, planning and executing process engineering projects for entire range of products
• Interacting with key customers to resolve significantly complex process engineering issues for entire range of products
• Developing and implementing new technology, products and analytical instrumentation
• Training, defining and implementing new methodologies, defining and applying new technologies, and/or troubleshoot, performing Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products
• Generating internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validating process engineering specifications for integrated products
• Contributing to market share gains through technology improvement.

What you already have...

• Bachelor's, Master's or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.
• 8+ years of semiconductor process engineering experience, including hands-on expertise in electroplating/electrochemical deposition technologies.
• Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.
• Proven experience leading process development, technology innovation, and product qualification in an R&D environment.
• Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.
• Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.
• Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.
• Experience collaborating with customers and cross-functional teams to resolve complex technical challenges.
• Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.