Principal HBM Reliability & Test Engineering Lead

Micron Technology; Singapore; On-site; SGD 80,000 - 110,000; Full time

Job summary

Micron Technology is seeking a candidate in Singapore to lead the High Bandwidth Memory (HBM) Product Engineering team. The person will develop a high-performing team focused on reliability test development for Micron's HBM products. The ideal candidate has a Bachelor's or Master's degree in Electrical or Electronics Engineering, with over 5 years of experience in the semiconductor industry. Good communication skills, problem-solving abilities, and experience with data analysis and scripting are essential. International travel may be required.

Qualifications

• 5+ years of semiconductor industry experience, preferably in product engineering.
• Strong understanding of circuit analysis.
• Excellent communication and presentation skills.

Responsibilities

• Define and develop reliability stress, test flows and test plans.
• Drive extrinsic DPM reduction and lead intrinsic reliability charter.
• Debug and identify root cause and failures in reliability tests.

Skills

Problem solving with root-cause analysis

Statistics and data analysis

Scripting tools like Python

Collaborative work

Communication and presentation skills

Education

Bachelor’s or Master’s degree in Electrical or Electronics Engineering

Tools

JMP

Job description

Micron Technology is seeking a candidate in Singapore to lead the High Bandwidth Memory (HBM) Product Engineering team. The person will develop a high-performing team focused on reliability test development for Micron's HBM products. The ideal candidate has a Bachelor's or Master's degree in Electrical or Electronics Engineering, with over 5 years of experience in the semiconductor industry. Good communication skills, problem-solving abilities, and experience with data analysis and scripting are essential. International travel may be required.