Polishing Engineer - Data-Driven CMP & Yield Lead

HOYA Electronics; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

HOYA Electronics Singapore Pte Ltd is seeking an engineer to lead polishing process development for CMP in semiconductor manufacturing. You will drive end-to-end improvements to yield, capacity, and uptime, while performing data-driven analysis and reporting.

Responsibilities include SOP maintenance, equipment qualification support, and managing consumables. The role requires a degree in Mechanical/Chemical Engineering or related field and 0–2 years of relevant semiconductor polishing

Qualifications

• Bachelor’s degree in Mechanical/Chemical Engineering or related field.
• 1–2 years of relevant semiconductor experience preferred (polishing, CMP or cleaning).

Responsibilities

• Lead end-to-end development and improvement of polishing processes to enhance yield, capacity, and manufacturing performance
• Own and sustain polishing processes, ensuring equipment performance, troubleshooting issues, and maintaining uptime
• Conduct root cause analysis on process and product failures, implementing effective corrective and preventive actions
• Analyze process data, run experiments, and prepare key reports (e.g., TQYR, engineering reports, and troubleshooting summaries)
• Develop, maintain, and enhance SOPs while supporting equipment qualification, validation, and engineering collaborations
• Manage consumables and spare parts planning, support equipment upgrades, and perform ad hoc tasks as assigned

Skills

Microsoft Office

Power BI

Data analysis

Statistics / SPC

Education

Bachelor’s Degree in Mechanical / Chemical Engineering or related field

Tools

JMP

Job description

HOYA Electronics Singapore Pte Ltd is seeking an engineer to lead polishing process development for CMP in semiconductor manufacturing. You will drive end-to-end improvements to yield, capacity, and uptime, while performing data-driven analysis and reporting.

Responsibilities include SOP maintenance, equipment qualification support, and managing consumables. The role requires a degree in Mechanical/Chemical Engineering or related field and 0–2 years of relevant semiconductor polishing