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HOYA Electronics Singapore Pte Ltd is seeking an engineer to lead polishing process development for CMP in semiconductor manufacturing. You will drive end-to-end improvements to yield, capacity, and uptime, while performing data-driven analysis and reporting.
Responsibilities include SOP maintenance, equipment qualification support, and managing consumables. The role requires a degree in Mechanical/Chemical Engineering or related field and 0–2 years of relevant semiconductor polishing
HOYA Electronics’ primary focus is on the development of optical and extreme ultraviolet (EUV) photomask blanks, which are critical components in the manufacturing process of the latest-generation chips used in various applications such as artificial intelligence, high-performance computing, and 5G, as well as the production of various memory, logic, and power devices.
HOYA Electronics Singapore Pte Ltd is an equal opportunity employer. We are committed to building diverse teams and creating a safe and inclusive workplace that enables our people to perform at their best, regardless of nationality, ethnicity, religion, age, disability status, gender identity or sexual orientation, and other attributes that make every individual unique.
An offer with HOYA Electronics Singapore is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
HOYA Electronics Singapore does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with HOYA Electronics Singapore.