Pilot-Line Semiconductor Process Engineer

National University of Singapore

Singapore

On-site

SGD 120,000 - 180,000

Full time

14 days+

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Job summary

The National University of Singapore is seeking a driven engineer to spearhead pilot-line development for wafer bonding and MOCVD epitaxy within the ETP - Administration at Kent Ridge Campus. You will own end-to-end process architecture, develop robust recipes, and drive yield, traceability, and industry-ready transfer documentation.

You will lead a multidisciplinary team in a fast-paced environment, coordinating with external foundries and suppliers to ensure scalable, industry-grade samples

Qualifications

  • Proven experience in semiconductor process development, integration, or pilot-line scale-up.
  • Hands-on expertise in wafer bonding, epitaxial growth (111-V and GaN), and supporting unit processes such as CMP, thermal processing, and metallization readiness.
  • Experience defining end-to-end process flows and transitioning technologies from lab or prototype stage to pilot production.
  • Strong background in yield engineering, SPC, process control, and root-cause analysis.
  • Experience selecting, qualifying, and sustaining semiconductor process equipment and metrology tools.
  • Experience producing comprehensive process documentation and transfer packages suitable for industry-grade sampling.
  • Prior experience leading or mentoring multi-disciplinary engineering teams.

Responsibilities

  • Define the pilot-line process architecture & roadmap for the targeted platform.
  • Develop, optimise, and lock process recipes for scale across modules (wafer bonding, epitaxy, CMP, thermal steps).
  • Lead hands-on process development and optimisation to achieve high yield and repeatability.
  • Drive yield ramp plans and sustainment with CTQ parameters and SPC monitors.
  • Select and qualify toolsets; plan preventive maintenance and uptime.
  • Coordinate with external foundries, epi/material suppliers, and supply-chain teams.
  • Produce the transfer package: flows, BOMs, specs, recipes, control plans, and traceability.

Skills

Semiconductor process development
Wafer bonding
Epitaxial growth GaN/111-V
SPC/process control
Root-cause analysis
Documentation/transfer packages
Team leadership

Tools

Metrology tools
Equipment qualification

Job description

The National University of Singapore is seeking a driven engineer to spearhead pilot-line development for wafer bonding and MOCVD epitaxy within the ETP - Administration at Kent Ridge Campus. You will own end-to-end process architecture, develop robust recipes, and drive yield, traceability, and industry-ready transfer documentation.

You will lead a multidisciplinary team in a fast-paced environment, coordinating with external foundries and suppliers to ensure scalable, industry-grade samples

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