Senior Manager, Package PE, Product and System Engineering (High Bandwidth Memory)

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 100,000 - 150,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking a seasoned technical leader to drive innovation in the semiconductor industry. The role focuses on leadership development, project management, and cross-functional collaboration to enhance technological advancements.

With a Bachelor's/Master's degree in Engineering and over 12 years of industry experience, the ideal candidate will possess strong problem-solving abilities and a commitment to developing future leaders.

Qualifications

• More than 12 years in the semiconductor industry.
• Proven leadership in a technical role.
• Strong problem-solving skills through circuit analysis.

Responsibilities

• Lead the development of future semiconductor leaders.
• Enhance skills and provide mentorship within the team.
• Manage projects and ensure timely delivery of solutions.

Skills

Leadership skills

Technical problem-solving

Collaboration

Project management

Communication skills

Education

Bachelor's/Master's in Electrical/Electronic/Mechanical Engineering

Job description

Key Responsibilities

• Leadership Development: By coaching and providing career development, this role ensures the growth of future leaders in the semiconductor industry, which is vital for driving innovation and technological advancement.
• Skill Enhancement: The role involves identifying strengths and creating specific development plans to improve skills, ensuring continuous skill enhancement to keep up with the rapidly evolving technology landscape.
• Mentorship and Development of Others: The role involves actively developing and mentoring others, which is important for the growth and development of the team and the organization.
• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization, directly impacting the direction of technological development.
• Cross‑Functional Collaboration: The role necessitates collaboration with various cross‑functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams, essential for the holistic development and shipping of end products.

Technical Responsibilities

• Test Coverage for DPM Reduction: Accountable for improving assembly‑related coverage within the manufacturing flows to reduce Time‑0 and package failure DPM and prevent inline fallout within the assembly process; work on electrical failure analysis and screens/stress development (DFT) for Time‑0 coverage.
• Yield improvement with Electrical Failure Analysis: Improve HBM yield through test optimization and coverages by collaborating with Technology Development and Packaging organizations to reduce Manufacturing Line Yield, and understanding inspection fail defects and testing to enhance electrical test coverages.
• Root Cause and Resolution of Qual and RMA Packaging Issues: Debug and identify root cause and failures through electrical failure analysis (EFA) and physical failure analysis (PFA), and drive for resolution and improvements through cross‑functional team collaboration on test coverages and process improvement.

Additional Responsibilities

• Subject Matter Expert: Serve as the go‑to expert in the domain field, providing guidance and insights to support decision‑making and strategy development.
• Leading Complex Projects: Define and drive critical multi‑disciplinary projects to ensure successful execution and completion.
• Organization Spokesperson and Expert: Act as the main contact and expert, providing detailed analysis on project and technical issues.
• Developing Future Leaders: Coach and mentor team members to foster the growth of future technical leaders in the organization.
• Innovation and Improvement: Continuously seek and implement innovative solutions to improve processes and technologies.

Requirements

• Bachelor's/Master's of Electrical/Electronic/Mechanical Engineering Degree with more than 12 years of experience in the semiconductor industry.
• Product Engineering and Packaging Experience is preferred.
• Demonstrating strong leadership skills and technical skills, especially in problem‑solving with root‑cause understanding and solution space through in‑depth circuit analysis.
• Candidate with proven leadership in a technical role is preferred.
• Dedicated and highly motivated with a flexible approach toward adapting to different roles in a dynamic working environment.
• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
• Strong sense of responsibility and accountability toward assigned role with professional work ethic.
• Excellent communication, collaboration, and presentation skills.
• Passionate about people and technical leadership, with a drive toward ongoing learning and development in this area.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail].

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.