Packaging Design and SI/PI Engineer

Lyte

Singapore

On-site

SGD 60,000 - 90,000

Full time

14 days+
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Benefits offered by this job

Competitive salary and equity
Comprehensive medical, dental, and vision coverage
401(k) retirement plan
Flexible vacation and time-off policy

Job summary

A technology company in Singapore is seeking a middle to senior level packaging design and signal/power integrity Engineer. The role involves designing micro-electronic packages, collaborating with a multi-disciplinary team, and optimizing performance through simulation. Candidates should possess a Bachelor’s degree and 5 years of experience, with strong skills in substrate design and EDA tools like Siwave and HFSS. The position offers competitive salary, comprehensive benefits, and opportunities to work with cutting-edge technologies.

Qualifications

  • Minimal requirement is a bachelor's degree with 5 years of experience.
  • Fluent in English communication, able to collaborate with teammates in different time zones.
  • Experience with hands-on testing of electronic packages/systems.

Responsibilities

  • Own the design and layout of the micro-electronic package.
  • Collaborate with a multi-disciplinary team to define performance specifications.
  • Perform signal/power integrity simulation to optimize performance.

Skills

Fluent in English communication
Experience in substrate design and packaging technology
Experience in EDA tools: Siwave, HFSS, APD
Programming skills (Python or C++)

Education

Bachelor's degree in Electrical Engineering or related field
Master’s degree (preferred)

Tools

Siwave
HFSS
Altium

Job description

About Lyte

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next‑generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai.

About the Role

We are seeking a middle to senior level packaging design and signal/power integrity Engineer with a degree in Electrical Engineering, or a related field.

What You'll Do
  • Own the design and layout of our micro‑electronic package, the heart of our LyteCore system
  • Collaborate with a multi‑disciplinary team of engineers (silicon, photonics, system, operations) to define physical and electrical performance specifications for the package
  • Perform signal/power integrity simulation to optimize our package & system performance
  • Work with our substrate/package vendors to ensure design for manufacturability and support delivery of our design on time; work with said vendors to define high volume price target
  • Project tracking weekly
  • Write technical reports and present results
  • Maintain EDA tools and actively project future needs, including improving design flow definition and recommending EDA envelope
Required Qualifications
  • Minimal requirement is a bachelor's degree with 5 years of experience
  • Fluent in English communication, able to collaborate with teammates in different time zones
  • Experience in substrate design and packaging technology
  • Experience in signal and power integration simulation and interpretation of the results
  • Experience in EDA tools: Siwave, HFSS, APD, or similar
  • Maintain company confidential information are a must
Preferred Qualifications
  • Master’s degree with more experience is highly desired
  • Proactive member of the multi‑disciplinary team, takes ownership of technical challenges and works with others to resolve issues
  • Experience with hands‑on testing of electronic packages/systems.
  • Knowledge and experience in at least some of the following processes: device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
  • Experience in other EDA tools such as Altium, Allegro PCB, Spectre, Hspice, Sigrity, ADS.
  • Data analysis experience such as JMPs a plus; excel is OK.
  • Programming and software maintenance skills are desired eg. python, or C++
  • Describe the experience and attributes of the ideal candidate
Benefits (subject to location and local regulations)
  • Competitive salary and equity
  • Comprehensive medical, dental, and vision coverage
  • 401(k) retirement plan
  • Flexible vacation and time‑off policy
  • Collaborative, fast‑paced, and inclusive work environment
  • Opportunity to work on cutting‑edge technologies with a highly cross‑functional team
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