Assembly and Packaging Process Engineer

Lyte; Singapore; On-site; SGD 40,000 - 70,000; Full time

Benefits offered by this job

Competitive salary and equity

Comprehensive medical, dental, and 125

401(k) retirement plan

Flexible vacation and time-off policy

Collaborative, fast-paced, and cross‑c

Cutting-edge technologies with cross‑f

Job summary

Lyte is seeking an entry to mid-level assembly and packaging engineer with a degree in Electrical Engineering, Photonics, or a related field. The role focuses on supporting device packaging processes with OSATs and contract manufacturers across Asia for NPI and volume production.

You will write technical reports, track weekly project progress, and analyze Cp/Cpk metrics while maintaining test software and firmware support.

Qualifications

• Bachelor's degree required with 1 year of experience in assembly/packaging or a related field.
• Strong English communication skills are required.
• Experience with PCB assembly and SMT is preferred.
• Hands-on lab experience and data analysis skills are expected.
• Proficiency with Microsoft Office is required.
• Fast learner with good work ethics and ability to maintain confidentiality.

Responsibilities

• Collaborate with OSATs in Asia to support device packaging process improvements for NPI and volume manufacture.
• Support CM activities in Asia for optical engine and subcomponent assembly and process improvements.
• Track project progress on a weekly basis.
• Write technical reports and present results.
• Analyze data and monitor OSATs, assembly houses, and contract manufacturers (Cp and Cpk) for internal use.
• Assist tests and reliability work at component, device, optical engine, and module system levels.
• Maintain software and firmware support for testing setups.

Skills

English communication

MS Office

Fast learner

Good work ethics

Confidential information handling

PCB assembly with SMT

Data analysis

Education

Bachelor's degree in Electrical Engineering or related field

Tools

SolidWorks

Engineering drawing

Excel

JMP

Python/C++

Job description

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

About Lyte

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!

About The Role

• We are seeking an entry or middle level assembly and packaging Engineer with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.

What You’ll Do

• Work with our OSAT in Asia to support company device packaging process improvements for NPI and volume manufacture
• Work with our CMs (contract manufactures) in Asia to support our optical engine and subcomponent assembly and process improvement for NPI and volume manufacture
• Project tracking weekly.
• Write technical reports and present results.
• Analyze data and track OSATs, Assembly houses, contract manufacturers Cp and Cpk for internal use.
• Support tests and reliability work at component level CoC, device level, optical engine, and module system assembly.
• Maintain the software and firmware support for testing and relevant setups.

Required Qualifications

• Minimal requirement is a bachelor's degree with 1 years of experience.
• The successful candidate need have English communication capability.
• Experience or knowledge of PCB assembly with SMT line
• Hands-on experience in laboratory experimentation and data analysis
• English communication capability is a must.
• Familiar with Microsoft Office.
• Fast learner is a must.
• Good work ethics and Maintain company confidential information are a must

Preferred Qualifications

• Higher degree with more experience is highly desired.
• Experience with microelectronic device packaging.
• Former experience of optical device packaging is highly desirable.
• Experience with hands-on testing of photonic and electronic. device/components.
• Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA.
• Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
• Experience in SolidWorks and familiar with Engineering drawing is a plus.
• Data analysis experience such as JMPs is a plus; excel is OK.
• Programming and software maintenance skills are desired eg. python, or C++
• Understanding the microelectronic reliability tests and mechanical reliability tests are desirable.
• Experience in microsystem assembly such as hard disk assembly is a plus.

Benefits (subject to location and local regulations)

• Competitive salary and equity
• Comprehensive medical, dental, and vision coverage
• 401(k) retirement plan
• Flexible vacation and time-off policy
• Collaborative, fast-paced, and inclusive work environment
• Opportunity to work on cutting-edge technologies with a highly cross-functional team