Micro Assembly Assistant Engineer (3 months - renewable) #JTL

RECRUIT EXPRESS PTE LTD; Singapore; On-site; SGD 28,000 - 42,000; Full time

Job summary

RECRUIT EXPRESS PTE LTD in Singapore seeks a Micro Assembly Technician to assist in die attach and wirebonding for prototype and production products. You will operate associated equipment and perform routine maintenance in line with approved procedures.

Responsibilities include supporting early builds, conducting visual inspections with microscopes, handling RF ICs and other components with proper ESD controls, and recording data to ensure traceability and quality compliance.

Qualifications

• Minimum NITEC/ Diploma/ Degree in Electrical & Electronics Engineering.
• Preferably with experiences in die attach and wire bonding.

Responsibilities

• Assist the Micro Assembly Engineer in die attach and wirebonding for prototype and production products.
• Operate microelectronics assembly equipment, including die attach and wirebonding machines, in accordance with approved procedures and work instructions.
• Perform operation and routine maintenance of assembly equipment and tooling.
• Handle and assemble RF ICs, capacitors, inductors, substrates, and other microelectronic components using proper ESD controls and handling procedures.
• Support prototype, first article, and pre-production builds by performing assembly and inspection tasks.
• Conduct visual inspection of assembled products using microscopes and other inspection equipment to ensure compliance with workmanship standards.
• Assist in rework and repair activities as required to meet product quality requirements.
• Accurately record production and assembly data, ensuring traceability and compliance with quality system requirements.

Skills

Die attach

Wire bonding

Visual inspection

Data recording

Education

NITEC/ Diploma/ Degree in Electrical & Electronics Engineering

Tools

Die attach machine

Wire bonding machine

ESD handling equipment

Microscopes

Job description

1. Assist the Micro Assembly Engineer in die attach and wirebonding for prototype and production products.
2. Operate microelectronics assembly equipment, including die attach and wirebonding machines, in accordance with approved procedures and work instructions.
3. Perform operation and routine maintenance of assembly equipment and tooling.
4. Handle and assemble RF ICs, capacitors, inductors, substrates, and other microelectronic components using proper ESD controls and handling procedures.
5. Support prototype, first article, and pre-production builds by performing assembly and inspection tasks.
6. Conduct visual inspection of assembled products using microscopes and other inspection equipment to ensure compliance with workmanship standards.
7. Assist in rework and repair activities as required to meet product quality requirements.
8. Accurately record production and assembly data, ensuring traceability and compliance with quality system requirements.

Requirements

• Minimum NITEC/ Diploma/ Degree in Electrical & Electronics Engineering
• Preferably with experiences in die attach and wire bonding

Interested candidates please send in your resume to:
Topaz Liang Huimin (CEI No. R1104500), email to: [e-mail]
EA License No: 99C4599