Member of Technical Staff (MTS) – 3D NAND Process Integration

Micron Technology, Inc.; Singapore; Sur place; SGD 80 000 - 120 000; Plein temps

Résumé du poste

1100 Micron SemiAsiaOP Pte Ltd in Singapore seeks skilled candidates to drive 3D NAND integration and technology roadmap. The role involves end-to-end development including learning vehicles and characterizations, collaborating across R&D teams to drive performance innovations.

Ideal candidates hold an MS or PhD in relevant fields and possess strong experience in semiconductor physics and process integration, coupled with a passion for innovation and AI-driven solutions.

Qualifications

• MS or PhD in relevant fields required.
• Strong foundation in semiconductor device physics and process integration.
• Proven ability in experiment design and data analysis.

Responsabilités

• Drive 3D NAND integration and technology roadmap.
• Lead end-to-end development including learning vehicles and characterization.
• Collaborate across teams to drive performance and yield learning.

Connaissances

Semiconductor device physics

Experiment design

Data analysis

Collaboration skills

Innovation mindset

Formation

MS or PhD in Electrical Engineering, Materials Science, Physics, Chemical Engineering or related field

Outils

AI/ML techniques

Data analytics tools

Description du poste

Key Responsibilities

• Drive 3D NAND integration and technology roadmap, leading pathfinding and advanced architecture enablement.
• Lead end‑to‑end development (conception → technology validation) including learning vehicles, characterization, and debug.
• Solve complex integration challenges using data‑driven, AI‑assisted, and model‑based approaches, identifying critical technology gaps and enabling solutions.
• Define and optimize module/process architecture (electrical targets, process flows, design rules) to meet product requirements.
• Collaborate across the full ecosystem (Device, Probe, Test, Design, Operations) to drive performance, yield learning, and execution.
• Drive technical innovation through process improvements, patents, and publications while building strong global networks.
• Integrate AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contribute to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one's scope of work.

Qualifications

• MS or PhD in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field.
• Strong foundation in semiconductor device physics and process integration.
• Experience in memory (NAND/DRAM), CMOS/logic, or emerging/embedded memory technologies.
• Proven ability in experiment design, data analysis, and problem‑solving.
• Ability to work across cross‑functional R&D teams.
• Strong communication and collaboration skills.
• Demonstrated innovation mindset, with exposure to advanced data analytics or AI/ML techniques a plus.
• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.