Mechanical Design Engineer ( Flip-chip / Die-bonding / Semiconductor Equipment )

The Supreme HR Advisory Pte Ltd; Singapore; Sur place; SGD 45 000 - 67 000; Plein temps

Résumé du poste

The Supreme HR Advisory Pte. Ltd. is seeking a Junior Mechanical Design Engineer in Singapore to develop mechanical systems for advanced semiconductor packaging equipment.

You will produce 3D models, detailed drawings, and BOMs, while collaborating with cross-functional teams to ensure precision and reliability. Requirements include a diploma or degree in mechanical fields, 2+ years of design experience, and proficiency in CAD tools (Creo, SolidWorks, Inventor, CATIA or NX).

Qualifications

• Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or related discipline.
• Approximately 2+ years of mechanical design experience in semiconductor equipment, precision automation, machine building, or motion systems.
• Proficiency in 3D CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.
• Ability to prepare detailed manufacturing and assembly drawings.
• Good understanding of fits, tolerances, GD&T, and bearings/linear-motion components.
• Able to develop practical mechanism concepts beyond drawings from instructions.
• Willing to support machine assembly, debugging, testing, and continuous improvement.
• Experience in semiconductor packaging or semiconductor automation equipment.
• Experience designing precision, high-stiffness, or thermally stable machine modules.
• Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.
• Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.
• Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.
• Experience taking a module from concept through assembly, testing, and customer acceptance.
• Familiarity with DFM, DFA, cost reduction, and engineering change control.
• Experience with prototype, customized, or first-of-a-kind equipment development.

Responsabilités

• Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.
• Develop 3D models, detailed drawings, assemblies, BOMs, and technical documentation.
• Design modules such as wafer handling and substrate handling systems.
• Create die ejection, die pickup, and die transfer mechanisms; multi-axis positioning stages.
• Design bondheads, thermal bondheads, and related micro-mechanisms.
• Select mechanical and motion components including bearings, motors, encoders, actuators, and sensors.
• Conduct tolerance stack-up analyses and design reviews for precision assemblies.
• Ensure positioning accuracy, repeatability, and structural stiffness; manage thermal effects.
• Collaborate with process, electrical, software, vision, motion-control, and manufacturing teams.
• Support machine assembly, alignment, integration, testing, and customer qualification.
• Investigate machine issues and implement design improvements; document changes.

Connaissances

Mechanical design

3D CAD conceptualization

Tolerance analysis

DFM and DFA

Cross-functional collaboration

Formation

Diploma or Bachelor's in Mechanical Engineering / Mechatronics / Precision Engineering / Automation

Outils

Creo

SolidWorks

Inventor

CATIA

NX

Description du poste

Position title : Junior Mechanical Design Engineer

• Admirax St
• 5 Day A Week (9:00am - 6:00pm)
• SGD 4,000 - SGD 6,000/month (Based on experience and technical capability)

Responsibilities:

• Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.
• Develop mechanical concepts, 3D models, detailed drawings, assembly drawings, BOMs, and technical documentation.
• Design equipment modules such as:
  • Wafer handling systems
  • Substrate, strip, panel, or glass-panel handling systems
  • Die ejection, die pickup, and die transfer mechanisms
  • Precision XY, XYZ, XYZT, and multi-axis positioning stages
  • Bondheads and thermal bondheads
  • Micro-Z, force-control, compliance, and tip-tilt mechanisms
  • Heating, cooling, vacuum, gas, and thermal isolation structures
  • Conversion kits, change parts, fixtures, tooling, nests, and bond tools
• Select suitable mechanical and motion components, including bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, and flexures.
• Conduct tolerance stack-up and design reviews for critical precision assemblies.
• Consider positioning accuracy, repeatability, structural stiffness, vibration, thermal expansion, force transmission, alignment, and serviceability in the design.
• Work closely with process, electrical, software, vision, motion-control, manufacturing, procurement, and service teams.
• Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.
• Investigate machine problems and implement practical design improvements.
• Improve existing modules for better accuracy, reliability, cycle time, manufacturability, and cost.
• Maintain proper engineering documentation and design-change records.

Requirements:

Candidates will be considered from the following backgrounds, in order of preference:

1. TCB equipment
   • Thermo-Compression Bonding
   • Chip-to-substrate, chip-to-wafer, or chip-to-panel bonding
   • HBM, large-die, fluxless bonding, or advanced packaging equipment
2. Flip-chip or die-bonding equipment
   • Flip-chip bonders
   • Die bonders
   • Die attach or semiconductor pick-and-place systems
3. Semiconductor handling equipment
   • Wafer handling
   • Substrate, strip, panel, or glass-panel handling
   • Die ejection, die pickup, or die transfer
   • EFEM, robot, aligner, elevator, buffer, or transfer mechanisms
4. Precision positioning stages
   • XY, XYZ, XYZT, or multi-axis stages
   • Gantry systems
   • Cross-roller-bearing stages
   • Flexure-guided mechanisms
   • High-accuracy motion platforms
5. Bondhead or thermal module design
   • Bondheads
   • Thermal bondheads
   • Force-control mechanisms
   • Micro-Z systems
   • Load-cell integration
   • Heating and cooling assemblies
   • Parallelism or tip-tilt correction systems
6. Conversion kits, tooling, and fixtures
   • Machine conversion kits
   • Product change parts
   • Vacuum tooling
   • Bond tools
   • Wafer, substrate, or panel fixtures
   • Calibration and alignment jigs

Candidates are not expected to have experience in all the above areas. Strong design capability in one or more relevant modules is sufficient.

Requirements:

• Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or a related discipline.
• Approximately 2 or more years of mechanical design experience in semiconductor equipment, precision automation, machine building, motion systems, or related industries.
• Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.
• Able to prepare detailed manufacturing and assembly drawings.
• Good understanding of:
  • Fits and tolerances
  • GD&T
  • Bearings and linear-motion components
  • Machining and fabrication processes
  • Material selection and surface treatment
  • Mechanical assembly and alignment
• Able to develop practical mechanism concepts rather than only produce drawings from instructions.
• Willing to support machine assembly, debugging, testing, and continuous improvement.
• Experience in semiconductor packaging or semiconductor automation equipment.
• Experience designing precision, high-stiffness, or thermally stable machine modules.
• Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.
• Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.
• Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.
• Experience taking a module from concept through assembly, testing, and customer acceptance.
• Familiarity with DFM, DFA, cost reduction, and engineering change control.
• Experience with prototype, customised, or first-of-a-kind equipment development.