Mechanical Design Engineer (Semiconductor)

Adecco Personnel Pte Ltd (Perm); Singapore; On-site; SGD 42,000 - 72,000; Full time

Job summary

A global client in the semiconductor equipment industry is seeking a Mechanical Design Engineer to develop concepts for CES, CIP and R&D projects. You will perform analyses, create 3D models, drawings and BOMs, and manage ECOs while collaborating with internal teams and suppliers.

You will apply Creo and SAP in a hands-on lab and manufacturing environment, contributing to design reviews and ensuring manufacturability and serviceability of complex systems.

Qualifications

• Bachelor's or master's degree in Mechanical Engineering or related field.
• Minimum 2 years of mechanical design experience or equivalent.
• Strong knowledge of mechanics, materials science and engineering principles.

Responsibilities

• Develop mechanical design concepts and feasibility studies for CES, CIP and R&D projects.
• Participate in design reviews and provide technical insights and alternate concepts.
• Perform analyses and develop solutions for wafer handling, robotics, vacuum systems and transmission components.
• Design and develop tooling, fixtures and processes for assembly and maintenance.
• Create 3D models, 2D drawings and BOMs; manage ECOs and test specs.
• Collaborate with customers, vendors and cross-functional teams to meet objectives.
• Utilize SAP and Creo to document and support project activities.
• Provide hands-on support in lab and manufacturing settings including testing.

Skills

Mechanical design

Engineering analysis

Project management

Team collaboration

Education

Bachelor's or Master's in Mechanical Engineering

Tools

Creo (Pro/ENGINEER)

SAP

Job description

Our client is a global semiconductor equipment manufacturer headquartered in the United States, specializing in the design, manufacture and support of advanced wafer-processing equipment used in the fabrication of integrated circuits. Its technology portfolio includes solutions for plasma etch, dry strip, surface treatment and thermal processing, supporting leading semiconductor manufacturers worldwide.

The Job

• Develop mechanical design concepts and conduct feasibility studies for new CES, CIP and R&D projects.
• Participate in formal and informal design reviews, contributing technical insights, alternative design concepts and recommendations.
• Perform engineering analysis and develop solutions across areas including wafer handling and transfer, robotics, friction and particle control, vacuum systems, end effectors, precision mechanisms, slit valves, lift pins, indexers and wafer temperature management.
• Design and develop custom mechanical tooling, fixtures and associated processes to support the handling, assembly and disassembly of components, sub-assemblies and complete systems throughout the product lifecycle.
• Create detailed 3D models, assemblies, 2D engineering drawings and Bills of Materials, and manage Engineering Change Orders (ECOs), test specifications, functional specifications and product documentation.
• Collaborate closely with internal and external customers, vendors and cross-functional teams to align expectations and deliver project objectives.
• Utilise SAP, Pro/ENGINEER (Creo) and other engineering software to manage, document and support project activities.
• Provide hands-on engineering support in the laboratory and manufacturing environment, including installation, testing and troubleshooting of CES/CIP designs deployed on customer systems.

The Talent

Education & Experience

• Bachelor's or Master's degree in Mechanical Engineering or a related engineering discipline.
• Minimum 2 years of directly relevant mechanical design experience, or equivalent practical experience.

Technical Knowledge & Experience

• Strong knowledge of mechanical engineering design, mechanics and materials science, with the ability to apply engineering principles and analytical techniques to solve complex engineering problems.
• Knowledge of areas such as thermodynamics, heat transfer, measurement and control, stress analysis, Finite Element Analysis (FEA) and system integration.
• Experience in robotics, precision mechanisms, RF, plasma, gas delivery, vacuum systems, temperature control and/or electrostatic clamping is highly desirable.
• General knowledge of materials, components and technologies used in the semiconductor equipment industry.
• Working knowledge of vacuum technology and its application in mechanical design.
• Strong proficiency in CAD tools, particularly CREO (Pro/ENGINEER), as well as SAP.

Other Competencies

• Strong problem-solving, communication, project management and teamwork skills.
• Ability to manage engineering changes and work effectively with customers, vendors and cross-functional teams.
• Customer-oriented mindset with strong attention to product quality and engineering requirements.
• Ability to develop cost-effective designs with consideration for serviceability and manufacturability.
• Comfortable working in both theoretical/analytical and hands-on practical environments.
• Able to work effectively under pressure and manage multiple engineering priorities.