Junior Mechanical Design Engineer - Semiconductor Equipment

The Supreme HR Advisory Pte. Ltd.; Singapore; On-site; SGD 45,000 - 67,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd. is seeking a Junior Mechanical Design Engineer in Singapore to develop mechanical systems for advanced semiconductor packaging equipment.

You will produce 3D models, detailed drawings, and BOMs, while collaborating with cross-functional teams to ensure precision and reliability. Requirements include a diploma or degree in mechanical fields, 2+ years of design experience, and proficiency in CAD tools (Creo, SolidWorks, Inventor, CATIA or NX).

Qualifications

• Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or related discipline.
• Approximately 2+ years of mechanical design experience in semiconductor equipment, precision automation, machine building, or motion systems.
• Proficiency in 3D CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.
• Ability to prepare detailed manufacturing and assembly drawings.
• Good understanding of fits, tolerances, GD&T, and bearings/linear-motion components.
• Able to develop practical mechanism concepts beyond drawings from instructions.
• Willing to support machine assembly, debugging, testing, and continuous improvement.
• Experience in semiconductor packaging or semiconductor automation equipment.
• Experience designing precision, high-stiffness, or thermally stable machine modules.
• Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.
• Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.
• Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.
• Experience taking a module from concept through assembly, testing, and customer acceptance.
• Familiarity with DFM, DFA, cost reduction, and engineering change control.
• Experience with prototype, customized, or first-of-a-kind equipment development.

Responsibilities

• Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.
• Develop 3D models, detailed drawings, assemblies, BOMs, and technical documentation.
• Design modules such as wafer handling and substrate handling systems.
• Create die ejection, die pickup, and die transfer mechanisms; multi-axis positioning stages.
• Design bondheads, thermal bondheads, and related micro-mechanisms.
• Select mechanical and motion components including bearings, motors, encoders, actuators, and sensors.
• Conduct tolerance stack-up analyses and design reviews for precision assemblies.
• Ensure positioning accuracy, repeatability, and structural stiffness; manage thermal effects.
• Collaborate with process, electrical, software, vision, motion-control, and manufacturing teams.
• Support machine assembly, alignment, integration, testing, and customer qualification.
• Investigate machine issues and implement design improvements; document changes.

Skills

Mechanical design

3D CAD conceptualization

Tolerance analysis

DFM and DFA

Cross-functional collaboration

Education

Diploma or Bachelor's in Mechanical Engineering / Mechatronics / Precision Engineering / Automation

Tools

Creo

SolidWorks

Inventor

CATIA

NX

Job description

The Supreme HR Advisory Pte. Ltd. is seeking a Junior Mechanical Design Engineer in Singapore to develop mechanical systems for advanced semiconductor packaging equipment.

You will produce 3D models, detailed drawings, and BOMs, while collaborating with cross-functional teams to ensure precision and reliability. Requirements include a diploma or degree in mechanical fields, 2+ years of design experience, and proficiency in CAD tools (Creo, SolidWorks, Inventor, CATIA or NX).