Head of Quantum Device Fabrication & Advanced Packaging

Universal Quantum Ltd.; Singapore; On-site; SGD 180,000 - 280,000; Full time

Job summary

Universal Quantum Ltd. is building the next generation of quantum computers with a focus on scalable fabrication, packaging, and assembly technologies for quantum processors.

The Head of Device Fabrication, Advanced Packaging and Assembly leads a global team and oversees foundry relationships across Singapore and Japan to deliver manufacturable solutions. The role combines technical leadership with external partner management and programme delivery, ensuring alignment with Systems Engineering,

Qualifications

• Degree in a technical discipline related to semiconductor engineering, materials science, physics, microelectronics or mechanical/chemical engineering.
• Proven experience leading multidisciplinary technical teams including senior engineers, specialists and managers.
• Extensive background in semiconductor process development, advanced packaging, assembly or device industrialisation in foundry/OSAT/IDM environments.
• Track record of taking process and technology development from concept through qualification to production readiness.
• Strong expertise across microfabrication, wafer processing, lithography, deposition, etch, bonding, interconnects, metrology and reliability.

Responsibilities

• Define and deliver technology roadmap and investment priorities for fabrication, packaging, assembly and test of quantum processors.
• Build, lead and develop a global team across Singapore and Japan.
• Lead development and optimisation of foundry processes from concept to production.
• Drive development and industrialisation of packaging, assembly, bonding and interconnect solutions.
• Manage strategic relationships with foundries, suppliers and technology partners.
• Own R&D programmes balancing short-term delivery with long-term tech development.
• Establish qualification and control processes for scalable, reliable manufacturing.
• Collaborate with design, product and architecture teams to deliver manufacturable specs.
• Maintain integrated development plans, budgets, suppliers, risks and performance measures.
• Ensure quality, reliability, safety, export-control and regulatory compliance.

Skills

Technology leadership

Global team leadership

Foundry process development

Advanced packaging

Supply chain partnerships

R&D management

Cross-functional collaboration

International leadership

Education

Degree in Semiconductor Engineering, Materials Science, Physics, Microelectronics, Mechanical Engineering, Chemical Engineering

Job description

Universal Quantum Ltd. is building the next generation of quantum computers with a focus on scalable fabrication, packaging, and assembly technologies for quantum processors.

The Head of Device Fabrication, Advanced Packaging and Assembly leads a global team and oversees foundry relationships across Singapore and Japan to deliver manufacturable solutions. The role combines technical leadership with external partner management and programme delivery, ensuring alignment with Systems Engineering,