Global OSAT Operation Engineering

NXP Semiconductors; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

NXP Semiconductors Singapore is seeking a senior leader to drive yield, quality, reliability, and productivity across OSAT sites, coordinating with global teams to deliver qualification and capacity expansion projects.

You will own qualification planning, risk mitigation, and Safe Launch execution while leading cross-functional reviews and CAB/IRB participation. The role requires 8–10 years in semiconductor packaging and knowledge of advanced packaging technologies.

Qualifications

• Minimum 8–10 years of semiconductor assembly and packaging experience.
• Experience in OSAT management, site transfer, and qualification projects preferred.
• Knowledge of advanced packaging technologies is required.
• Experience in DOE, SPC, FDC, and RCA techniques is desirable.

Responsibilities

• Provide technical leadership for yield, quality, reliability, and productivity improvement programs across OSAT sites.
• Drive manufacturing excellence initiatives including cycle time reduction, bottleneck elimination, equipment qualification, and process optimization.
• Review and approve subcontractor 8D, CQC, Safe Launch reports, PCN submissions, and corrective/preventive action plans.
• Drive qualification planning and implementation of subcontractor changes including material, equipment, process and capacity expansion.
• Lead OSAT site transfer, second-source qualification, and capacity expansion projects for supply resilience and revenue growth.
• Own qualification planning, gap assessment, risk mitigation, Safe Launch execution, and PCN activities.
• Partner with global Product Engineering, Quality, Reliability, Supply Chain, and Manufacturing teams to ensure successful project execution and product commercialization.
• Lead supplier technical assessments, capability benchmarking, and readiness reviews for new and existing OSAT partners.
• Lead onsite root cause investigations and resolution of major quality incidents, yield excursions, customer issues, and severe incident escalations.

Skills

Project management

Leadership

Stakeholder management

Communication

Independent work

Education

Degree or MSc Degree in Mechanical, Materials, Manufacturing, Electronics Engineering or equivalent

Job description

Job Responsibilities

• Provide technical leadership for yield, quality, reliability, and productivity improvement programs across OSAT sites.
• Drive manufacturing excellence initiatives including cycle time reduction, bottleneck elimination, equipment qualification, and process optimization.
• Review and approve subcontractor 8D, CQC, Safe Launch reports, PCN submissions, and corrective/preventive action plans.
• Drive manufacturing excellence initiatives including cycle time reduction, bottleneck elimination, equipment qualification, and process optimization.
• Drive qualification and implementation of subcontractor changes including material, equipment, process, manufacturing site, floor layout, and capacity expansion for supply assurance.
• Lead OSAT site transfer, second-source qualification, and capacity expansion projects for supply resilience and revenue growth.
• Own qualification planning, gap assessment, risk mitigation, Safe Launch execution, and PCN activities.
• Partner with global Product Engineering, Quality, Reliability, Supply Chain, and Manufacturing teams to ensure successful project execution and product commercialization.
• Lead supplier technical assessments, capability benchmarking, and readiness reviews for new and existing OSAT partners.
• Lead onsite root cause investigations and resolution of major quality incidents, yield excursions, customer issues, and severe incident escalations.
• Support package documentation management, including bond diagrams, package kits, assembly flows, qualification reports, and change records.
• Participate as Change Action Board (CAB), Independent Review Board(IRB), and qualification review member for NPI/NTI, site transfer, and process change approvals.
• Champion Smart Factory initiatives by working with OSATs on AI/ML deployment, predictive analytics, automated defect detection, and manufacturing digitalization solutions.
• Provide regular executive updates and recommendations to management on qualification status, supply risks, quality performance, and strategic OSAT initiatives.

Requirements

• Degree or MSc Degree in Mechanical, Materials, Manufacturing, Electronics Engineering or equivalent.
• Minimum 8-10 years of semiconductor assembly and packaging experience, preferably in OSAT management, site transfer, and qualification projects.
• Technical knowledge in advanced packaging technologies such as WLCSP, FOWLP, Cu Pillar Bumping, and Flip-Chip.
• Additional experience in mainstream semiconductor packages including QFN, LQFP, and wire bond technologies will be an added advantage.
• Experience in package qualification, Safe Launch execution, change management (PCN), and subcontractor management.
• Knowledge of DOE, SPC, FDC, process control methodologies, reliability qualification, and root cause analysis techniques.
• Proven experience in yield improvement, quality management, and manufacturing productivity enhancement.
• Strong project management, leadership, and stakeholder management skills in a cross-functional global environment.
• Good communication and presentation skills with the ability to influence stakeholders at all organizational levels.
• Ability to work independently, manage multiple priorities, and drive projects to closure under tight timelines.
• Familiarity with AI/ML, Smart Factory, Industry 4.0 initiatives, and manufacturing digitalization is an added advantage.

More information about NXP in Singapore... #LI-6a60 NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.com Bright Minds. Bright Futures. We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills. Commitment At NXP. We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality. Thank you for considering a career at NXP.

NXP operates under a strict Preferred Supplier List (PSL) for all recruitment activities. Any candidate profiles or resume submitted without a prior written agreement or explicit request from our Talent Acquisition team will be considered unsolicited. Such submissions will be deemed free of any obligations, and no fees will be paid by NXP or any of its affiliates, subsidiaries, or divisions - regardless of whether the candidate is hired, either coincidentally or otherwise. Thank you for your understanding.