Failure Analysis Engineer – IC Packages & FA Reporting

ASE Singapore Pte Ltd; Singapore; On-site; SGD 33,000 - 60,000; Full time

Job summary

ASE Singapore Pte Ltd is seeking an engineer to perform loading and analysis on IC packages using FA and Reliability tools and equipment. You will support physical failure analysis, including parallel cross-sectioning, and perform basic failure analysis on electrical rejects from low yield and engineering lots.

The role requires a Diploma in Engineering (Electrical/Electronics) or equivalent and knowledge of FA equipment such as Curve Tracer, X-ray, CSAM, SEM.

Qualifications

• Diploma in Engineering, preferably Electrical/Electronics or equivalent.
• Knowledge of FA equipment and techniques like Curve Tracer, X-ray, CSAM, SEM, decapsulation, cross-section, fault isolation, polishing, warpage measurements.

Responsibilities

• Perform loading and analysis on IC packages using FA / Reliability tools and equipment.
• Support physical failure analysis such as parallel cross-sectioning on wafer level chip size package.
• Perform basic failure analysis on electrical rejects from low yield and engineering lots.
• Generate and finalize FA Report based on the FA procedure done.

Skills

Curve Tracer

X-ray

CSAM

SEM

Decapsulation

Cross-section

Education

Diploma in Engineering (Electrical/Electronics)

Tools

FA equipment

FA techniques

Job description

ASE Singapore Pte Ltd is seeking an engineer to perform loading and analysis on IC packages using FA and Reliability tools and equipment. You will support physical failure analysis, including parallel cross-sectioning, and perform basic failure analysis on electrical rejects from low yield and engineering lots.

The role requires a Diploma in Engineering (Electrical/Electronics) or equivalent and knowledge of FA equipment such as Curve Tracer, X-ray, CSAM, SEM.