Etch Process Engineer

APPLIED ANGSTROM TECHNOLOGY PTE. LTD.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Applied Angstrom TechnologyPte. Ltd. (AAT) is a start-up semiconductor equipment company headquartered in Singapore.

We seek a Process Engineer to develop advanced process formulations, define equipment requirements, evaluate data, and coordinate design to meet processing needs, impacting the next generation of semiconductor breakthroughs. The ideal candidate will conduct R&D in process engineering for cutting-edge equipment, improve processing techniques, and collaborate with cross-functional

Qualifications

• Bachelor’s or Master’s degree in Materials Science, Chemical Engineering, Chemistry, Physics, or a related engineering discipline.
• 3+ years of hands-on experience in semiconductor equipment development or semiconductor fab process engineering (R&D or pilot line preferred).
• Strong laboratory and tool operation skills, including wafer surface preparation, thin-film processes, and analytical/characterization techniques.
• Proficient in Statistical Process Control (SPC), Design of Experiments (DOE), and structured process optimization methodologies.
• Competent with statistical analysis tools such as JMP, Minitab, or equivalent for data modeling, correlation, and root-cause analysis.
• Solid understanding of plasma science, including RIE, ICP/CCP systems, Atomic Layer Etching (ALE), and plasma-surface interaction fundamentals.
• Knowledge in materials synthesis and characterization (e.g., XPS, AFM, SEM, ellipsometry, profilometry).
• Experience developing or optimizing semiconductor processes, such as dielectric/metal etch, thin-film deposition, surface modification, or nanoscale patterning.

Responsibilities

• Conduct process engineering research, development, and evaluation in support of AAT’s cutting-edge semiconductor equipment and systems.
• Review and enhance processing techniques and methods applied in the manufacture and fabrication of products.
• Develop and sustain new processes and process improvements to reduce production costs and increase yields.
• Compile and analyze test data to establish next steps in process development and determine appropriate limits and variables for process specifications.
• Collaborate internally to plan, collect data, analyze results, and report on customer demos for existing process applications.
• Partner cross-functionally with customers to understand roadmaps, process flow, inflection points, requirements, and business challenges.
• Contribute to next generation product development and release activities supporting the semiconductor roadmap.
• Provide leadership, clear direction, and guidance to process technicians to support execution activities.

Skills

Materials science

Chemical engineering

Lab techniques

DOE

SPC

Process optimization

Statistical analysis

Data analysis

Education

Bachelor's or Master's degree in Materials Science / related engineering

Tools

JMP

Minitab

XPS

AFM

SEM

Ellipsometry

Profilometry

Job description

Applied Angstrom TechnologyPte. Ltd.(“AAT”)is a start-up semiconductor equipment companywith ourheadquarter in Singapore. AAT has the mission to betheworld-classprocess technology providerin theAngstrom erafor 3D device manufacturingand to build anecosystemin equipment design, manufacturing, and component/materialsupply chaininUS andSingapore.

As a Process Engineer atAAT, you willoperate oncutting-edgetechnology, harnessing atomic precision, material science, and surface engineering to push technical boundaries. Your role involves developing new and advanced process formulations, defining equipment hardware to meet processing requirements, evaluating test data, and coordinating design requirements to ensure compatibilityofprocessing methods. Your expertise and knowledge play a crucial role in ourcustomerssuccess, making an impact on the next generation of semiconductor breakthroughs.

Job Description:

The ideal candidate shall be able to perform the following:

• Conduct process engineering research, development, and evaluation in support ofAAT’scutting-edgesemiconductor equipment and systems.

• Review and enhance processing techniques and methods applied in the manufacture and fabrication of products.

• Develop and sustain new processes and process improvements to reduce production costs and increase yields.

• Compile and analyze test data toestablishnext steps in process development and determineappropriate limitsand variables for process specifications.

• Collaborate internally to plan, collect data, analyze results, and report on customer demos for existing process applications.

• Partner cross-functionallyand with customers to understand roadmaps, process flow, inflection points, requirements, and business challenges.

• Contribute to next generation product development and release activities supporting the semiconductor roadmap.

• Provide leadership, clear direction, and guidance to process technicians to support execution activities.

Job Qualifications:

• Bachelor’s orMaster’sdegree in Materials Science, Chemical Engineering, Chemistry, Physics, ora relatedengineering discipline.

• 3+ years of hands-on experience in semiconductor equipment development or semiconductorfabprocess engineering (R&D or pilot line preferred).

• Strong laboratory and tool operation skills, including experience with wafer surface preparation, thin-film processes, and analytical/characterization techniques.

• Proficient in Statistical Process Control (SPC), Design of Experiments (DOE), and structured process optimization methodologies.

• Competent with statistical analysis tools such as JMP, Minitab, or equivalent for data modeling, correlation, and root-cause analysis.

• Solid understanding of plasma science, including RIE, ICP/CCP systems, Atomic Layer Etching (ALE), and plasma-surface interaction fundamentals.

• Knowledge in materials synthesis and characterization (e.g., XPS, AFM, SEM, ellipsometry, profilometry).

• Experience developing oroptimizingsemiconductor processes, such as dielectric/metal etch, thin-film deposition, surface modification, or nanoscale patterning.