Associate Engineer, Process

SILICON BOX PTE. LTD.; Singapore; On-site; SGD 40,000 - 60,000; Full time

Job summary

SILICON BOX PTE. LTD. is seeking a Process Associate Engineer to support engineering and production activities efficiently. This role is a great opportunity for candidates with semiconductor manufacturing experience.

Responsibilities include ensuring process integrity, monitoring production, and working on improvements. The successful candidate will need a diploma in relevant engineering fields and at least 2 years of experience, specifically in Molding and De-bonding processes. Flexibility for rotating shifts is required.

Qualifications

• Minimum 2 years’ experience in semiconductor manufacturing environment.
• Minimum 2 years of experience in Molding and De-bonding processes.
• Flexible to work under various shift patterns.

Responsibilities

• Ensure process integrity for the machine during production.
• Monitor processes using SPC and real-time systems.
• Work on process improvement projects.
• Handle disposition and on-hold lots.
• Maintain good housekeeping in the production area.
• Support recipe setup and qualification for production.
• Assist in troubleshooting process-related issues.
• Collect engineering data.
• Perform other ad-hoc duties as assigned.

Skills

Process monitoring

Basic SPC knowledge

Microsoft Office proficiency

Education

Diploma in electrical / mechatronics / mechanical/microelectronics engineering

Job description

Position Summary

Process Associate Engineer is responsible to support the engineering activities as well as the daily production activities reliably and efficiently.

Candidates with related experience in semiconductor and/or electronics manufacturing industry are encouraged to apply for this position.

Responsibilities

• Ensure process integrity for machine is in place for production
• Process monitoring via SPC / real time monitoring system
• Work on process improvement projects
• Handle disposition and on hold lots
• Maintain good housekeeping in the production area
• Support in recipe setup and qualification for production
• Assist to troubleshoot process-related issue
• Engineering data collection
• Other ad-hoc duties as assigned

Requirements

• Minimum diploma in electrical / mechatronics / mechanical/microelectronics engineering or similar discipline
• Minimum2 years’ experience working in semiconductor manufacturing environment
• Minimum 2 years of experience working in Molding, De-bonding process.
• Knowledge in basic SPC and Microsoft Office
• Flexible to work under various shift pattern. The selected candidate will start with office hours first, and eventually work on12-hour rotating shift (day and night)