Director, Advanced Packaging Process Engineering

Applied Materials South East Asia; Singapore; On-site; SGD 300,000 - 420,000; Full time

Job summary

Applied Materials South East Asia is seeking a Director, Process Support Engineer to lead technical strategy and customer engagements in advanced packaging. You will partner with customers and internal R&D teams to optimize processes and drive next‑generation packaging solutions.

You will influence roadmaps, lead demonstrations, and manage cross‑functional teams to deliver high‑impact outcomes in a global context. Based in the Woodlands office, Singapore.

Qualifications

• 15+ years of semiconductor industry experience with deep expertise in advanced packaging process development, process integration, customer engineering, or technology pathfinding.
• Strong knowledge of packaging technologies such as Fan-Out, CoWoS, 2.5D/3D integration, RDL, TSV, hybrid bonding, electroplating, CMP, wafer-level processing, and heterogeneous integration.
• Proven ability to influence customers and stakeholders across technical and executive levels.
• Experience leading strategic customer engagements, joint development programs, or technology commercialization initiatives is highly desirable.
• Experience with DOE, statistical process control, failure analysis, root cause investigation, and yield improvement.

Responsibilities

• Lead resolution of highly complex customer process challenges across advanced packaging applications using DOE and statistical methods.
• Establish cross-functional issue management, coordinating resources across units for timely resolution.
• Provide technical leadership for customer demonstrations and technology evaluations, defining process conditions and presenting results.
• Partner with strategic customers to develop and optimize packaging process flows to meet performance and manufacturing goals.
• Act as trusted advisor for advanced packaging technologies including wafer-level packaging and 2.5D/3D integration.
• Collaborate with product development and engineering to influence roadmaps and drive enhancements.
• Lead technology transfer and customer enablement, including process development and ramp support.
• Build partnerships with ведущими semiconductor manufacturers, OSATs, and research institutes to evaluate new tech.

Skills

DOE

Statistical process control

Root cause analysis

Leadership

Cross-functional collaboration

Communication

Education

PhD / MSc / Bachelors in Materials Science / Chemical Engineering / Electrical Engineering / Physics / Mechanical Engineering

Tools

Fan-Out packaging

CoWoS

2.5D/3D integration

RDL

TSV

Hybrid bonding

Electroplating

CMP

Wafer-level processing

Heterogeneous integration

Job description

Applied Materials South East Asia is seeking a Director, Process Support Engineer to lead technical strategy and customer engagements in advanced packaging. You will partner with customers and internal R&D teams to optimize processes and drive next‑generation packaging solutions.

You will influence roadmaps, lead demonstrations, and manage cross‑functional teams to deliver high‑impact outcomes in a global context. Based in the Woodlands office, Singapore.