Director, Advanced Packaging Innovation & Pathfinding

Applied Materials South East Asia Pte Ltd; Singapore; On-site; SGD 260,000 - 420,000; Full time

Job summary

Applied Materials South East Asia Pte Ltd is seeking a visionary Director to define and drive long-range pathfinding for N+2 and beyond advanced packaging technologies, shaping future integration architectures and new value creation.

You will build and lead a high-impact team focused on exploratory, pre-product technologies (D2W, RDL, CoWoS, TSV) and translate customer roadmaps into differentiated platforms that boost performance, cost efficiency, and scalability.

Qualifications

• 15+ years in semiconductor technology, including advanced packaging and related domains.
• Proven leadership in technology pathfinding, innovation strategy, or early-stage platform development.
• Deep understanding of current advanced packaging tech (D2W, RDL, CoWoS, TSV).
• Experience building and leading cross-functional R&D teams.
• Ability to translate complex technology concepts into business impact.

Responsibilities

• Define and execute long-range pathfinding roadmap for advanced packaging, identifying next inflection points.
• Lead concept incubation and feasibility exploration for disruptive packaging approaches.
• Translate customer roadmaps and market trends into actionable development strategies.
• Build and mentor a world-class innovation team and establish scalable governance.
• Drive partnerships across ecosystem and manage programs to align with executive priorities.
• Communicate technology trade-offs and investments to senior leadership.

Skills

15+ years in semiconductor technology

Technology pathfinding leadership

Advanced packaging knowledge

Cross-functional R&D leadership

Business impact translation

Education

PhD/MS in Materials Science or Electrical/Mechanical Engineering or Physics

Job description

Applied Materials South East Asia Pte Ltd is seeking a visionary Director to define and drive long-range pathfinding for N+2 and beyond advanced packaging technologies, shaping future integration architectures and new value creation.

You will build and lead a high-impact team focused on exploratory, pre-product technologies (D2W, RDL, CoWoS, TSV) and translate customer roadmaps into differentiated platforms that boost performance, cost efficiency, and scalability.