Director, Advanced Packaging Innovation

NanoHelp; Singapore; On-site; SGD 260,000 - 380,000; Full time

Job summary

A global semiconductor company in Singapore is seeking a Director of Advanced Packaging Technology Development to lead its innovation efforts in memory and storage packaging. The successful candidate will need a strong background in Materials Science, Electronics, or Mechanical Engineering, and will play a pivotal role in strategic decision-making, technical execution, and team leadership. This position offers substantial opportunities for impact and growth in a cutting-edge technology environment.

Qualifications

• Extensive experience in semiconductor packaging innovation.
• Proven leadership in managing large-scale teams.
• Track record of influencing corporate direction through technical excellence.

Responsibilities

• Define and lead APTD strategies aligned with global innovation goals.
• Guide advanced packaging roadmaps, including wafer bonding and warpage control.
• Collaborate across departments for cost-effective packaging.

Skills

Strategic thinking

Outstanding communication

Cross-functional coordination

Complex problem-solving

Education

PhD, Master's, or Bachelor's in Materials Science, Electronics, Mechanical or Applied Physics

Job description

A global semiconductor company in Singapore is seeking a Director of Advanced Packaging Technology Development to lead its innovation efforts in memory and storage packaging. The successful candidate will need a strong background in Materials Science, Electronics, or Mechanical Engineering, and will play a pivotal role in strategic decision-making, technical execution, and team leadership. This position offers substantial opportunities for impact and growth in a cutting-edge technology environment.