Back-end Packaging Design Engineer – Thermo-Compression Bonding (Semiconductor Industry) - YZ11

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading HR advisory firm in Singapore is looking for a TCB Design Engineer to design and optimize thermal bonding systems for semiconductor packaging. Candidates should have 2-5 years of relevant experience and strong CAD skills, preferably with CREO. The role offers a salary between $6000 - $8000 based on experience, and includes collaboration with engineers and thorough documentation of work.

Qualifications

• Minimum 2–5 years of hands-on experience in semiconductor packaging.
• Knowledge of bonding process and materials behaviour under stress.
• Experience in design of Modules like Bond head or Bond Stage.

Responsibilities

• Design innovative TCB modules for bonding.
• Collaborate with engineers for machine integration.
• Document all designs and simulations according to quality standards.

Skills

3D/2D CAD knowledge

Excellent trouble-shooting skills

Experience with TCB or Laser Assisted bonding

Statistical analysis (JMP, Minitab)

Education

Bachelor's or Master’s in Materials Science or related field

Tools

CREO Parametric

CREO Windchill PLM

Job description

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty Street

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : $6000 - $8000 (depends experience)

Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

• Design & Development
• Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
• Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
• Planning, Scheduling and Costing of Machines Modules.
• Prototyping & Testing
• Oversee fabrication of prototype modules and their integration with TCB platforms.
• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support
• Collaborate with Electrical, Vision and Software Engineers for the machine integration.
• Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
• Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Compliance & Documentation
• Document all designs, simulations, and test results according to quality management and IP standards.
• Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

• Thermal & Mechanical Analysis
• Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
• Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
• Ensure safe and stable mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Required Skills and Qualifications

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested applicants, WA your resume to [phone] or email your resume to [e-mail].

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R25138932

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279