[0580] Application & Process Engineer - Semiconductor Die Bonding / Advanced Packaging - Up to $6k / 5 days / Woodlands

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 33,000 - 67,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd. is seeking a semiconductor packaging engineer to lead design, development, and optimization of die bonding processes at our Woodlands North Coast site. The role involves translating customer requirements into robust packaging solutions and providing hands-on on-site support.

Responsibilities include troubleshooting, tool calibration, and collaboration with R&D and manufacturing teams to improve performance and yield. Travel for customer support may be required.

Qualifications

• Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials or related).
• 3+ years in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing.
• Knowledge of advanced packaging technologies (Flip-Chip, PoP, wafer-level, panel-level).
• Willingness to travel for customer support and on-site installations.

Responsibilities

• Lead design, development, optimization, and validation of software and hardware for die bonding processes.
• Translate customer requirements into semiconductor packaging solutions focusing on process optimization.
• Troubleshoot and analyze die attach tools, process issues, and software anomalies; implement corrective actions.
• Perform machine setup, calibration, and alignment to ensure yield and repeatability.
• Develop test procedures and documentation for process qualification and validation; maintain logs.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams on improvements.
• Provide on-site support and training for field application engineers and customers.

Skills

Troubleshooting

Problem-solving

Willingness to travel

Education

Bachelor's degree in Engineering

Master's degree in Engineering

Tools

Die bonding equipment

Semiconductor packaging equipment

Motion control systems

Job description

Working Location: Woodlands North Coast

Working Days: Monday - Friday

Working Hours: 9:00am -6:00pm

Starting Salary: $3,000 to $6,000

Responsibilities

• Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
• Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance.
• Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.
• Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.
• Develop test procedures, application recipes, and documentation for process qualification and validation; maintain detailed logs and technical reports.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.
• Provide on-site support for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
• Serve as a key interface between customers and the R&D team, delivering user feedback to guide tool enhancements and feature development.

Job Requirement

• Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, or related field).
• 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
• Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
• Experience with semiconductor equipment integration, motion control systems, and process development.
• Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
• Willingness to travel for customer support and on-site installations (as required).