Sr. Technician, Wirebond

AMPLEON PHILIPPINES, INC.; Laguna; On-site; PHP 480,000 - 720,000; Full time

Job summary

Ampleon Philippines, Inc. invites applications for a Backend Technology role based in Cabuyao, Philippines.

The successful candidate will join the Back-End Technology team and contribute to engineering evaluations and process development in a fast-paced semiconductor environment. The role requires a Bachelor's in Engineering (or equivalent) and at least four years of semiconductor manufacturing experience, including copper wirebond, GaN/LDMOS packaging knowledge, and RCA methodology proficiency.

Qualifications

• Bachelor's degree in Engineering or an equivalent Engineering/2-year Technical course.
• At least four years of experience in semiconductor manufacturing.
• Experience with copper wirebond.
• Knowledge of GaN and LDMOS in Over Mold packages (QFN, LGA).
• Experience with various measuring equipment and plasma machines.
• Familiarity with RCA methodologies (DMAIC, Why-why analysis).

Responsibilities

• Support STR and engineering evaluations in full compliance with work instructions, engineering standards and control plans.
• Support Au and/or Cu ball bonding using ASM and/or K&S machines.
• Develop support for GaN OMP, LGA and QFN packages.
• Support STR, Customer Samples and Prototype Builds.
• Support pre-development, development, DRM and DoE builds.
• Create recipe/programming and set-up for prototype and engineering builds (customer samples, DoE, development and qualification).

Skills

Copper wirebond

GaN/LDMOS packaging

DMAIC/Why-why analysis

Education

Bachelor's degree in Engineering

2-year Technical course

Tools

Measuring equipment

Plasma machine

Job description

The Back-End Technology team of Ampleon is based in Cabuyao, Philippines. You are going to be part of the team in Philippines, where technologies and development engineering projects are coming together. The Philippines team is an experienced team with engaged and passionate people. This position reports to the Sr. Manager, Back-End Technology.

To support STR and engineering evaluations in full compliance with work instructions, engineering standards and control plan set by stakeholders and deliver in a timely manner. You will also support the following activities:

• Au and/or Cu ball bonding using ASM and/or K&S machine
• Development support for GaN OMP, LGA and QFN packages.
• STR, Customer Samples and Prototype Builds Support.
• Pre-development, Development, DRM and DoE Builds support.
• Create Recipe/Programming and Set-up for Prototype and Engineering Builds (Customer Samples, DoE, Development and Qual).

Job Qualifications:

• Graduate with a Bachelor's degree in Engineering or an equivalent Engineering/ 2-year Technical course
• Must have at least four (4) years of experience in semiconductor manufacturing.
• With experience in Copper Wirebond.
• With knowledge on the following:
• Packages and Technology: GaN and LDMOS in Over Mold Package, QFN, and LGA
• Different measuring equipment and Plasma machine
• Basic RCA methodology, such as DMAIC, and Why-why analysis.