Sr. Technician, Singulation

Ampleon USA Inc.; Cabuyao; On-site; PHP 2,348,796 - 3,523,194; Full time

Benefits offered by this job

Growth and learning opportunities

Participation in various inspirational events

Job summary

A leading RF solutions provider in Cabuyao, Philippines, is seeking a semiconductor manufacturing engineer with a bachelor's degree in engineering and at least four years of relevant experience. Candidates should have hands-on experience with package saw singulation and molding processes. This role offers opportunities for growth and participation in international teams.

Qualifications

• At least four (4) years of experience in semiconductor manufacturing.
• Experience with trim form and package saw singulation processes.
• Knowledge of plasma machine.

Responsibilities

• Monitor package development in the Mold and Laser Marking areas.
• Create product recipes for pre-development and released products.
• Perform machine set-up and buy-off for development lots.

Skills

Subject-matter expertise in package saw singulation

Direct hands-on experience with equipment

Knowledge of different measuring equipment

Knowledge of RCA methodology

Education

Bachelor’s degree in engineering or an equivalent engineering/technical course

Job description

Permanent | Cabuyao, Philippines

Created in 2015 and headquartered in the Netherlands, Ampleon is shaped by nearly 60 years of RF Power leadership. The company envisions to advance society through innovative RF solutions based on GaN and LDMOS technologies.

Ampleon is dedicated to being the partner of choice by delivering high‑quality, high‑performance RF products with its world‑class talent. The portfolio offers flexibility in scaling design and production for any volume and addresses applications for 5G NR infrastructure, industrial, scientific, medical, broadcast, navigation and safety radio applications.

Proven reliability, secure supply and excellent product consistency enable highest manufacturing yields for customers who benefit from Ampleon being a one‑stop partner for RF power solutions. For more details, please visit www.ampleon.com.

The Back‑End Technology team of Ampleon is based in Cabuyao, Philippines. You will be part of a team where technologies and development engineering projects come together. This team is experienced and passionately engaged. This position reports to the MBE Lead, Back‑End Technology.

To support STR and engineering evaluations in full compliance with work instructions, engineering standards and control plan set by stakeholders and deliver in a timely manner, you will also support the following activities:

• Monitor and ensure package development in the Mold, Laser Marking, Package Saw Singulation/DTFS & SMBT areas are compliant with required specifications for process parameters, controls and methods during equipment & tools set‑up and running of lots
• Be able to create product recipes for pre‑development and for released product both in equipment (molding, laser marking, package saw singulation and DTFS) and measuring instruments (e.g., X‑ray, Smartscope, others)
• Perform measurements and data gathering on the processed lots (e.g.: SCAT/SCAN, wire sweep, contact angle, others)
• Perform machine set‑up/conversion and buy‑off to process development and NPI lots
• Implement value engineering to improve processes, equipment performance & material usage/consumption
• Assist engineers in creation and revisions of documents (e.g., specifications, procedures, working instructions, others)
• Assist NPI and equipment technicians for the release of product development lots
• Work in an international environment with over 35 nationalities working in cross‑functional teams across 16 locations
• Take advantage of growth and learning opportunities to develop yourself in Ampleon
• Participate in a variety of inspiring events throughout the year, such as development activities, sports and many more

We are looking for someone who has the following background and capabilities:

• Graduate with a bachelor’s degree in engineering or an equivalent engineering/technical course
• Subject‑matter expertise in package saw singulation (Disco‑Rokko system) or molding (ASM 3G system)
• At least four (4) years of experience in semiconductor manufacturing
• Experience with mold, laser marking, trim form and package saw singulation processes for laminates and leadframe‑based product
• Direct hands‑on experience with the equipment is a must
• Knowledge of different measuring equipment and plasma machine
• Knowledge of basic RCA methodology such as DMAIC, why‑why analysis

Application Process

To streamline the application process, please submit a detailed resume/CV, including your personal contact information, references, and a letter outlining your motivation. I give permission to archive my personal information for 1 year in the Ampleon talent pool.

After submitting your application, you will receive a confirmation e‑mail. The following stages will occur if you are selected for a fit screening:

• Fit screening interview with our regional HR business partner
• Interview with hiring team and HR representatives (3 to 6 interviews involving hiring managers, peers, and HR)
• Contract offer upon successful negotiation
• Onboarding, supported by information, events, and continuous assistance from your supervisor and a buddy