Sr. Engineer, NTI/NPI in Back-End Technology (R&D)

Ampleon; Cabuyao; On-site; PHP 900,000 - 1,200,000; Full time

Job summary

Ampleon in Laguna, Philippines seeks a Sr. Engineer, NTI/NPI to lead and manage new technology, platform, and product introduction, focusing on interconnect assembly for Back-End Technology.

You will drive development and qualification of new interconnect processes, establish design rules and roadmaps, and collaborate with manufacturing, QA, and support teams to ensure a smooth transfer to high-volume production.

Qualifications

• Bachelor's degree in Electronics Engineering, Electrical Engineering, Industrial Engineering, Manufacturing Engineering, or a related field.
• Experience in project management within electronics manufacturing, semiconductor packaging.
• Strong understanding of RF product assembly processes, SMT, die attach, wire bonding, soldering, testing, and manufacturing operations (is a must).
• Knowledge of project management methodologies and tools. (PCP)
• Strong leadership, organizational, communication, and problem-solving skills.
• PMP, CAPM, Agile, or other project management certification is a plus
• Familiarity with Lean Manufacturing, Six Sigma, APQP, PFMEA, SPC, and Process Validation methodologies.

Responsibilities

• Lead and manage new technology, platform, and product introduction for Back-End Technology focused on interconnect, pre-development and/or development.
• Develop new interconnect processes to support new products/packages and create new business opportunities.
• Evaluate, qualify, and introduce new processes/methodologies through DoE in compliance with design rules and release procedures for high-volume production.
• Participate in establishing design rules and process roadmaps.
• Develop new tooling and breakthrough procedures to improve process development cycle time and efficiency.
• Provide day-to-day package/process support with focus on cost reduction and efficiency improvement.
• Coordinate with manufacturing/QA/process engineers and support teams to release new packages/products and transfer projects smoothly.
• Prepare and review DFMEA, DfM and Control Plan for NTI/NPI releases.

Skills

Project management

RF assembly processes

SMT

Die attach

Wire bonding

Soldering

Testing

Manufacturing operations

PMP/CAPM/Agile certs

Lean/Six Sigma

APQP/PFMEA

Process validation

Leadership

Communication

Education

Bachelor's degree in Electronics/Elect Electrical/Industrial/Manufacturing Engineering

Tools

PCP

Job description

• Bachelor's degree in Electronics Engineering, Electrical Engineering, Industrial Engineering, Manufacturing Engineering, or a related field.
• Experience in project management within electronics manufacturing, semiconductor packaging,
• Strong understanding of RF product assembly processes, SMT, die attach, wire bonding, soldering, testing, and manufacturing operations (is a must)
• Knowledge of project management methodologies and tools. (PCP)
• Strong leadership, organizational, communication, and problem-solving skills.
• PMP, CAPM, Agile, or other project management certification is a plus
• Familiarity with Lean Manufacturing, Six Sigma, APQP, PFMEA, SPC, and Process Validation methodologies.

You will be the Sr. Engineer, NTI/NPI in Back-End Technology where you will lead and manage new technology, platform, and product introduction, either pre-development and/or development for Assembly Process focused on interconnect.

• Technical expertise: Assembly – preferably with knowledge in interconnect (any of the following; having multiple competences in interconnect is a plus): Wirebond (Au/Al/Cu)/Flip Chip/Clip Bond/Ribbon/Sinter/SMT etc.
• Application of project management approach in development such as PCP or APQP or equivalent.
• Responsible for developing new interconnect processes to support new products/packages to create new business opportunities.
• Evaluate, qualify, and introduce new process/methodology though DoE definition, in compliance with the design rules and release procedures to ensure that the product is ready for high volume production.
• Participate in establishing design rules and process roadmaps.
• Develop new tooling and define breakthrough procedures which would improve process development cycle time/efficiency.
• Provide day-to-day package/process support requirements focused on cost reduction and efficiency improvement.
• Coordinate with manufacturing/QA/process engineers and support teams to release new packages/products and transfer projects smoothly.
• Preparing and reviewing Risk Assessment (DFMEA), Design for Manufacturing (DfM) and Control Plan for NTI/NPI releases.