Senior Reliability Engineer: Advanced Packaging & SMT

Infineon Technologies AG; Manila; On-site; PHP 400,000 - 650,000; Full time

Job summary

Infineon Technologies AG is seeking an Engineer Reliability in Manila to lead reliability assessment strategies for new semiconductor package technologies. You will define test plans, analyze failure data, and collaborate with cross‑functional teams to ensure package reliability meets customer requirements.

The role involves executing stress tests, evaluating data, and supporting qualifications for new packages and production changes, including chip embedding and high-density power modules for

Qualifications

• Bachelor's or Master's degree in Materials Science, Physics, Electrical Engineering, or Electronics Engineering.
• 1–3 years in frontend or backend semiconductor manufacturing; reliability/qualification experience preferred.
• Proactive, independent worker with strong teamwork and communication.

Responsibilities

• Define a reliability assessment plan for new package technologies and set customer mission profiles.
• Identify new failure modes, detect outliers, and assess risks beyond existing standards.
• Execute reliability stress tests, analyze data, and derive conclusions and recommendations.
• Participate in package delta analyses and risk assessments.
• Support qualification of new packages, processes, and production changes.
• Evaluate and qualify chip embedding packages and high-density power modules for AI applications.
• Create work instructions for physical failure analysis.
• Ensure adherence to reliability standards.

Skills

Reliability

Python

Tableau

FMEA

Statistical analysis

Education

Bachelor's or Master's in Materials Science/Physics/Electrical Engineering/Electronics Engineering

Tools

Python

Tableau

Job description

Infineon Technologies AG is seeking an Engineer Reliability in Manila to lead reliability assessment strategies for new semiconductor package technologies. You will define test plans, analyze failure data, and collaborate with cross‑functional teams to ensure package reliability meets customer requirements.

The role involves executing stress tests, evaluating data, and supporting qualifications for new packages and production changes, including chip embedding and high-density power modules for