Molding Process Development Engineer II – Product Launch

Tyco Electronics Philippines, Inc.

Tanauan

On-site

PHP 600,000 - 1,200,000

Full time

14 days+

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Job summary

Tyco Electronics Philippines, Inc. in Tanauan, Leyte, is seeking an experienced MFG & PROCESS DVL Engineer II – Molding to lead new molding process development for mass production and ensure KPI targets are met.

You will collaborate with MPDE teams in China and product design teams in the US, driving DOE and tooling qualification, and mentoring teams through LVM to HVM manufacturing stages.

Qualifications

  • Bachelor's degree in mechanical engineering or related field.
  • 5+ years of mold design, process, and troubleshooting knowledge.
  • Strong knowledge of injection molding processes and related tooling.
  • Fluent in written and spoken English.
  • Overseas working experience is a plus.
  • Knowledge of BTI 5-Step process and SIM.

Responsibilities

  • Overall molding process development, coordinating with interaction processes to optimize cost.
  • Concept design and proofing for molding process and tooling; DOE.
  • Technical leader and troubleshooter from LVM to HVM in process development, tooling design, and qualification.
  • Platforming manufacturing process development.
  • Launch product at rate through cross-functional teams; meet KPI.
  • Process documentation (DFM, FMEAs, WI, FACA/QCPC).

Skills

Mold design
Process development
DOE
Quality control
Teamwork
English communication
Cost optimization
Project management
Overseas experience

Education

Bachelor's degree in mechanical engineering

Tools

Moldflow
SIM (Scientific Injection Molding)
CAD
Pro/E
FMEA
DFM

Job description

Tyco Electronics Philippines, Inc. in Tanauan, Leyte, is seeking an experienced MFG & PROCESS DVL Engineer II – Molding to lead new molding process development for mass production and ensure KPI targets are met.

You will collaborate with MPDE teams in China and product design teams in the US, driving DOE and tooling qualification, and mentoring teams through LVM to HVM manufacturing stages.

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