GaN Package Engineering Lead — Thermal & Reliability

Navitas Semiconductor; Muntinlupa; On-site; PHP 1,800,000 - 3,000,000; Full time

Job summary

Navitas Semiconductor in the Philippines seeks a senior package design engineer to drive internal assembly design of GaN devices, BOM and process flow in a target footprint. You will lead cross-functional reviews and collaborate with OSAT development and Navitas Operations/NPI teams to mitigate risks and finalize designs.

Responsibilities include package development, validation of designs and materials, reliability look-ahead evaluations, final POR qualification, and comprehensive documentation

Qualifications

• Bachelor’s or MS degree in a technical field as listed.
• 15+ years experience in package design and development.
• Strong understanding of power semiconductor device physics and manufacturing processes.

Responsibilities

• Initiates internal assembly design of GaN device, BOM and process flow in a target package footprint.
• Drives design validation, BOM and process-of-records across teams.
• Leads cross-functional reviews and coordinates with OSAT, NPI and Navitas Operations teams.
• Supports Look-ahead reliability evaluations and post-stress analysis.
• Generates and maintains package engineering documentation per product development process.

Skills

Leadership experience

Cross-functional collaboration

Communication skills

DRIVERS for design reviews

SPC/DOE/FMEA knowledge

Education

Bachelor’s or MS in Semiconductor Engineering / Materials Science / Chemical Engineering

Tools

2D CAD

Job description

Navitas Semiconductor in the Philippines seeks a senior package design engineer to drive internal assembly design of GaN devices, BOM and process flow in a target footprint. You will lead cross-functional reviews and collaborate with OSAT development and Navitas Operations/NPI teams to mitigate risks and finalize designs.

Responsibilities include package development, validation of designs and materials, reliability look-ahead evaluations, final POR qualification, and comprehensive documentation