GaN Package Engineer - Design & Reliability

Navitas Semiconductor Usa; Muntinlupa; On-site; PHP 1,200,000 - 1,800,000; Full time

Job summary

Navitas Semiconductor Usa in Manila is seeking a senior Package Development Engineer to lead assembly design, BOM and process flow for GaN devices, collaborating with OSAT and Navitas teams. You will drive risk assessment, design validation, and reliability evaluations, oversee POR qualifications, and generate comprehensive package engineering deliverables for new product development.

The role requires 15+ years in package design and strong knowledge of power device physics, with preferred

Qualifications

• Bachelor's or MS in a related technical field.
• At least 15 years experience in package design and development.
• Strong understanding of power semiconductor device physics and manufacturing processes.
• Experience with SiC and/or GaN technologies preferred.
• Proven leadership in engineering projects and mentoring teams.

Responsibilities

• Initiates internal assembly design of GaN device, BOM & Process flow.
• Prepares preliminary Build diagram and Package Outline Drawings.
• Conducts risk assessment with mitigation actions in collaboration with OSAT and Navitas teams.
• Collaborates with Simulation engineer for thermal/thermo-mechanical stress simulations.
• Leads cross-functional reviews to finalize proposed designs.

Skills

Power device physics

Risk assessment

Cross-functional leadership

Documentation

Communication

Project mentoring

Process control

Quality analytics

Education

Bachelor's or MS in Semiconductor Eng./Materials Science/Chemical Eng.

Tools

2D CAD

Job description

Navitas Semiconductor Usa in Manila is seeking a senior Package Development Engineer to lead assembly design, BOM and process flow for GaN devices, collaborating with OSAT and Navitas teams. You will drive risk assessment, design validation, and reliability evaluations, oversee POR qualifications, and generate comprehensive package engineering deliverables for new product development.

The role requires 15+ years in package design and strong knowledge of power device physics, with preferred