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LSP – Light Sensors & Photonics, a unit within ams OSRAM, seeks an engineer to drive process evaluation, development, and optimization. You will participate in FMEA with cross-functional teams, set up production lines, and collaborate with QA/Engineering to pre-empt issues.
Responsibilities include packaging material evaluation and documenting work instructions. Ideal candidates have 2–3 years in tape and reel and AOI systems, a engineering degree, and are willing to rotate 12-hour shifts
We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.