Thermal/Mechanical Sr. Engineer - Eindhoven - Contract

microTECH Global Limited; Netherlands; On-site; EUR 70,000 - 90,000; Full time

Job summary

microTECH Global Limited is looking for a Thermal and Mechanical Sr. Engineer in Eindhoven, Netherlands. This on-site role involves designing and validating cooling solutions for high-performance electronics products. Required qualifications include a Master's degree in Mechanical Engineering and 5-10 years of relevant experience in mechanical and thermal design. Familiarity with CAD software and CFD analysis is essential, as well as strong communication skills for reporting to senior stakeholders. The role offers a 6-month contract with the potential for extension.

Qualifications

• 5–10 years of experience in mechanical and thermal design for electronics products.
• Proven experience with AI accelerators and HPC-class cooling architectures.
• Strong communication and interpersonal skills.

Responsibilities

• Design accelerator cards and platforms with mechanical fit and thermal performance.
• Test and validate cooling solutions end-to-end.

Skills

Mechanical and thermal design for electronics products

CFD and FEM analysis

2D/3D CAD proficiency

Hands-on thermal lab experience

Fluent in English

Education

Master’s degree in Mechanical Engineering or related field

Tools

NX

SolidWorks

Catia

FloEFD

ANSYS

Job description

Job Title: Thermal and Mechanical Sr. Engineer

Location: Eindhoven, Netherlands (On-site)

About the role:

We are seeking a Thermal and Mechanical sr. Eng. for a client, initially be on a 6 month contract!

• Support the design of accelerator cards and platforms, ensuring mechanical fit and thermal performance from concept to production hand-off — whether the cooling solution is developed in-house or outsourced to specialised cooling-solution suppliers.
• Test and validate the cooling solution end-to-end, including thermal simulation, simulation-to-test correlation, lab execution, and characterisation reporting suitable for senior management, suppliers, and customers.

Required Qualifications

• Master’s degree in Mechanical Engineering, Thermal Engineering, or related field.
• 5–10 years of experience in mechanical and thermal design for electronics products at board and system level, including high-power-density and HPC-class platforms.
• Extensive experience with CFD and FEM analysis of cooling solutions in electronics products.
• Proven experience with AI accelerators, HPC-class cooling architectures: high‑TDP chip cooling (200 W+), forced‑air server integration, heat pipe and vapor chamber design.
• Proficiency in 2D/3D CAD (e.g., NX, SolidWorks, Catia, Creo, Solid Edge) and thermal simulation tools (e.g., FloEFD, ANSYS, COMSOL), including system‑level airflow and rack‑level thermal modelling.
• Hands‑on experience operating a thermal lab: thermal/climatic chambers, multi‑channel data acquisition systems, sensor calibration, and instrumentation troubleshooting.
• Strong communication and interpersonal skills — able to deliver concise, structured status updates and present clear technical conclusions to senior stakeholders and external partners.
• Working knowledge of Python (or equivalent scripting language) for data acquisition, post‑processing, and test automation.
• Fluent in English, both spoken and written.

Preferred Skills

• Experience with AI/ML accelerator hardware, PCIe/M.2 form factors, or high‑density edge compute platforms.
• Familiarity with production quality processes (8D, FMEA, PPAP) and electromechanical co‑design with PCB layout engineers.
• Familiarity with measurement automation frameworks (LabVIEW, Python with PyVISA / PyDAQmx, or equivalent) and version‑controlled lab data pipelines.