Senior RF Engineer - Flex Interconnect & Systems Leader

QuantWare; Delft; On-site; EUR 90,000 - 120,000; Full time

Benefits offered by this job

Competitive salary

Hybrid setup

Pension plan

L&D budget

Team events

Job summary

QuantWare is seeking a Senior RF engineer to own the end-to-end design of flex interconnects for its VIO platform. You will drive architecture, verification, and high-volume manufacturing while balancing RF performance, mechanical reliability, and cryogenic considerations.

You will lead cross-functional teams, manage external vendors, and push for co-development partnerships to meet ambitious R&D goals. This role blends hardware design with project leadership in a hybrid setup.

Qualifications

• 4+ years of hands-on experience in RF engineering, signal integrity, or high-frequency interconnect design.
• Experience with RF simulation software (HFSS, CST, ADS) and RF test equipment (VNAs, spectrum analyzers, TDR).
• Proven track record leading hardware or R&D projects from concept to volume production.
• Vendor co-development experience with external partners or suppliers.
• Cross-functional leadership and strong communication to align multi-disciplinary teams.

Responsibilities

• Drive full flex interconnect architecture lifecycle from concept through verification to high-volume manufacturing.
• Maintain signal integrity and RF performance with mechanical reliability and thermal management.
• Manage external vendors and translate RF/mechanical specs into clear requirements.
• Own supplier development schedules and ensure timely delivery while maintaining quality.
• Lead and mentor the engineering team dedicated to flex interconnect development and RF integration.

Skills

RF engineering

Signal integrity

High-frequency interconnect design

HFSS

CST

ADS

VNA

Spectrum Analyzers

TDR

Vendor management

Cross-functional leadership

Tools

HFSS

CST

ADS

VNAs

Spectrum Analyzers

TDR

Job description

QuantWare is seeking a Senior RF engineer to own the end-to-end design of flex interconnects for its VIO platform. You will drive architecture, verification, and high-volume manufacturing while balancing RF performance, mechanical reliability, and cryogenic considerations.

You will lead cross-functional teams, manage external vendors, and push for co-development partnerships to meet ambitious R&D goals. This role blends hardware design with project leadership in a hybrid setup.