Senior Process Engineer – Power Electronics Packaging

TNO; Nijmegen; Hybrid; EUR 78,120 - 106,020; Full time

Benefits offered by this job

Holiday pay 8%

13th-month bonus 8.33%

Flex budget 5.58% + €180

33 days annual leave

Flexible working hours

Work from home

Relocation package

Good pension

Tailored employee benefits

Job summary

TNO is seeking a Senior Process Engineer in Nijmegen to lead the development of advanced die‑attach solutions for power electronics. You will work at the interface of packaging design, materials science and semiconductor assembly, coordinating DoEs and experimental validation across multiple projects with international collaboration.

You will mentor students and junior engineers while reporting progress to customers and stakeholders in English.

Qualifications

• Minimum 8 years of experience in semiconductor packaging development.
• Extensive knowledge of semiconductor assembly and packaging technologies.
• Experience with packaging and tooling design using 2D and 3D design software such as AutoCAD and/or SolidWorks.
• Proven experience with DoE methodologies, data analysis and experimental process development.
• Experience with advanced assembly, die‑attach and interconnection technologies.
• Knowledge of Ag and Cu sintering processes is highly desirable.
• Hands‑on mentality and the ability to independently plan and execute technical work.
• Strong communication skills and the ability to present technical results in English to industrial customers and partners.

Responsibilities

• Define and optimize assembly processes and production flows for new die‑attach technologies, including processes for thin die assembly (≤50 µm).
• Design packages and packaging components for power electronics (e.g., lead frames and clips).
• Design tooling for packaging manufacturing and assembly, such as lead‑frame tooling, vacuum pick‑up tools and other product‑specific fixtures.
• Set up, execute and analyse Design of Experiments (DoE) for materials and process development.
• Analyse experimental results and translate findings into process improvements and technological recommendations.
• Program and operate advanced packaging and assembly equipment.
• Report technical progress and results to customers and project stakeholders.
• Provide technical supervision to students and junior engineers.

Skills

Semiconductor packaging

DoE methodologies

Data analysis

AutoCAD

SolidWorks

Project leadership

English communication

Tools

AutoCAD

SolidWorks

Job description

TNO is seeking a Senior Process Engineer in Nijmegen to lead the development of advanced die‑attach solutions for power electronics. You will work at the interface of packaging design, materials science and semiconductor assembly, coordinating DoEs and experimental validation across multiple projects with international collaboration.

You will mentor students and junior engineers while reporting progress to customers and stakeholders in English.