R&D Scientist, Micro-Optical Assembly & Packaging

TNO; Eindhoven; On-site; EUR 70,000 - 95,000; Full time

Benefits offered by this job

8% holiday pay

13th month bonus

Flexible mobility plan

Relocation package

Pension scheme

Job summary

TNO is seeking a Scientist Micro-Optical Assembly & Packaging to advance optical interconnects and packaging for integrated photonic systems. You will work at the interface of photonics design, materials science, and chip packaging, contributing to scalable industrial solutions.

The role requires hands-on experimental work, several years in photonics packaging, and strong collaboration with multidisciplinary teams across PITC and CITC at TNO.

Qualifications

• Master's degree or PhD in Optical Engineering, Applied Physics, Materials Science, or a related field.
• Several years of experience in integrated photonics or micro-optical assembly.
• Hands-on laboratory experience and experimental work.
• Experience with advanced packaging technologies (flip-chip, wafer-level packaging) a plus.
• Experience with optical modelling tools (Zemax, Lumerical) and metrology equipment.
• Strong English communication skills.

Responsibilities

• Define and execute research activities on packaging technologies to improve performance and manufacturability.
• Design optical interconnects and coupling solutions for integrated photonic systems.
• Translate results into reliable and scalable photonic packaging solutions with industry partners.
• Document results through reports, publications, and presentations.
• Collaborate with multidisciplinary teams across photonics design, device manufacturing, materials science, and system integration.

Skills

Photonic integration

Optical assembly

Microscale packaging

Lab experiments

English communication

Education

Master's or PhD in Optical Engineering / related

Tools

Zemax

Lumerical

Wafer bonding tooling

Job description

TNO is seeking a Scientist Micro-Optical Assembly & Packaging to advance optical interconnects and packaging for integrated photonic systems. You will work at the interface of photonics design, materials science, and chip packaging, contributing to scalable industrial solutions.

The role requires hands-on experimental work, several years in photonics packaging, and strong collaboration with multidisciplinary teams across PITC and CITC at TNO.