Photonics Packaging Process Engineer - Real-World Impact

TNO

Nijmegen

Remote

EUR 60,000 - 84,000

Full time

2 days ago
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Benefits offered by this job

Relocation package
International relocation support
Flexible working hours
Home working option

Job summary

TNO Nijmegen is seeking a Process Engineer Photonics Packaging to develop and optimize assembly processes connecting photonic integrated circuits to optical, electrical, mechanical and thermal interfaces. You translate new integration concepts into scalable process flows and validate them through structured experimental work.

You will work hands-on in the laboratory, collaborating with scientists, equipment specialists and industry partners across the full development cycle, from process

Qualifications

  • A BSc or MSc degree in mechanical engineering, applied physics, electrical engineering, or a related discipline.
  • At least three years of relevant experience in photonics packaging, semiconductor assembly, micro-assembly, precision engineering or a similar high-tech manufacturing environment.
  • Experience with structured process development, experimental design (DoE), data analysis and technical problem solving.

Responsibilities

  • Develop, optimize and document assembly and integration processes for photonic devices, sub-assemblies and modules.
  • Set up and execute processes such as high-precision die placement, adhesive bonding, flip-chip assembly, soldering, wire bonding, fiber or optical interface attachment, and passive or active alignment.
  • Design and conduct experiments, including DoE, to gain insight into process windows and improve accuracy, yield, reliability and scalability.
  • Collaborate with industrial partners and customers on national and international R&D projects and clearly report progress and results.
  • Support knowledge transfer from R&D development to pilot-scale manufacturing and share expertise within multidisciplinary project teams.

Skills

Die placement
Adhesive bonding
Flip-chip assembly
Soldering
Wire bonding
Fiber/optical attachment
Alignment techniques
DoE experiments
Data analysis
Technical problem solving
Reading technical drawings
English communication

Education

BSc or MSc in mechanical eng / applied physics / electrical engineering

Job description

TNO Nijmegen is seeking a Process Engineer Photonics Packaging to develop and optimize assembly processes connecting photonic integrated circuits to optical, electrical, mechanical and thermal interfaces. You translate new integration concepts into scalable process flows and validate them through structured experimental work.

You will work hands-on in the laboratory, collaborating with scientists, equipment specialists and industry partners across the full development cycle, from process

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