Photonics Advanced Packaging Engineer

imec the Netherlands; Eindhoven; On-site; EUR 75,000 - 95,000; Full time

Benefits offered by this job

Pension plan

Flexible working hours

Relocation support

Training opportunities

Job summary

imec The Netherlands in Eindhoven is seeking a Photonics Advanced Packaging Engineer to identify and enable photonic packaging paths for integrated photonics across research projects such as Laser, LiDAR, and Datacom. You will lead laser integration packaging, manage workflows with internal and external partners, and develop next-generation packaging technologies.

The role emphasizes ownership, collaboration, and delivering outcomes in an international environment.

Qualifications

• MSc with 4+ years of experience or PhD in EE, physics, photonics, ME or equivalent.
• Hands-on experience with semiconductor laser packaging, including fiber coupling, butt coupling, and laser assembly techniques.
• Good understanding of laser-related packaging processes.
• Solid understanding of electrical packaging and opto-electronic integration.
• Experience with packaging design and mechanical CAD tools (SolidWorks 3D) is a strong advantage.
• Expertise of high-speed interconnects is a strong plus.
• Experience with the design, simulation, and characterization of photonic integrated circuits (PICs) and opto-electronic components—including lasers, photodetectors, modulators, and spot-size converters—is an advantage. Familiarity with photonic simulation tools such as FDTD is a plus.
• Proven project management skills are a plus
• Self-driven and entrepreneurial attitude – you derive energy from taking ownership and can effectively deal with ambiguity. Able to think ahead and make plans in an organized manner.
• Good written and verbal communication skills in English.

Responsibilities

• Lead the development of laser integration and packaging solutions for integrated photonics, with a strong focus on III–V to Silicon (Silicon Nitride) packaging strategies.
• Own and manage established packaging workflows in close collaboration with internal teams and external partners
• Build new packaging paths for operational excellence and new demands.
• Establish and improve design-for-packaging (DfP) guidelines covering optical, electrical, and thermal aspects.
• Develop next-generation packaging and integration technologies for emerging applications.
• Define and evaluate packaging architecture options, including trade-offs in performance, cost, and manufacturability.
• Take the ownership of planning, scheduling, and execution of packaging campaigns as well as performance and yield analysis.
• Demonstration and validation of packaged chips in a lab environment.
• Share insights and experiences with the team and contribute to the development and maturity of packaging.
• Prepare technical notes and documentation for internal and external customers. Optionally, file patents or publish your work.

Skills

Semiconductor laser packaging

Fiber coupling

Butt coupling

Laser assembly

Electrical packaging

Opto-electronic integration

On-chip laser coupling

Photonic integration

Project management

Education

MSc or PhD in EE/Physics/Photonics/ME

Tools

SolidWorks 3D

FDTD

Job description

As a Photonics advanced packaging engineer, you will contribute to developing photonic solutions for a wide range of different research projects including Laser, Hybrid integration, LiDAR, Co-Packaged Optics, Datacom, and Biosensors. This starts with identifying and enabling photonic packaging paths for integrated photonics in collaboration with internal and external partners. With these packaging paths, you manage efficient operation of the packaging processes and develop next-generation photonics packaging technologies.

You will be part of our interdisciplinary team. In this position, you will have a key and visible role in this initiative. Your main tasks will be:

• Lead the development of laser integration and packaging solutions for integrated photonics, with a strong focus on III–V to Silicon (Silicon Nitride)packaging strategies.
• Own and manage established packaging workflows in close collaboration with internal teams and external partners
• Build new packaging paths for operational excellence and new demands.
• Establish and improve design-for-packaging (DfP) guidelines covering optical, electrical, and thermal aspects.
• Develop next-generation packaging and integration technologies for emerging applications.
• Define and evaluate packaging architecture options, including trade-offs in performance, cost, and manufacturability.
• Take the ownership of planning, scheduling, and execution of packaging campaigns as well as performance and yield analysis.
• Demonstration and validation of packaged chips in a lab environment.
• Share insights and experiences with the team and contribute to the development and maturity of packaging.
• Prepare technical notes and documentation for internal and external customers. Optionally, file patents or publish your work.

What we do for you

We offer a challenging environment at the forefront of technology, in an international network of renowned industrial customers. This is your opportunity to bring new technologies to the market that will have an impact on tomorrow’s society.

Imec The Netherlands, as an employer of choice, offers you an attractive compensation and benefits package including a 100% employer-paid pension plan and flexible working hours. Furthermore, imec-NL offers a wide range of training possibilities. For international candidates, we provide support in the relocation process.

By joining the R&D team in Eindhoven, you will be part of a team of disruptive innovators and thinkers. Together, with our researchers and engineers, you will work on a variety of topics, including healthcare, agrifood, mobility and communications. We invite you to be part of our ambitious team where your ideas will have an impact on our society and our future lives.

Who you are

• MSc with 4+ years of experience or Ph.D. in EE, physics, photonics, ME or equivalent with a few years of experience.
• Hands-on experience with semiconductor laser packaging, including fiber coupling, butt coupling, and laser assembly techniques, is essential.
• Good understanding of laser-related packaging processes is a must-have.
• Solid understanding of electrical packaging and opto-electronic integration is highly desirable.
• Good understanding of concepts in on- chip laser coupling is a strong plus
• Industry field experience in photonics packaging is a strong plus. (strong academic experience will also be considered.
• Experience with packaging design and mechanical CAD tools (e.g., SolidWorks 3D) is a strong advantage.
• Expertise of high-speed interconnects is a strong plus.
• Experience with the design, simulation, and characterization of photonic integrated circuits (PICs) and opto-electronic components—including lasers, photodetectors, modulators, and spot-size converters—is an advantage. Familiarity with photonic simulation tools such as FDTD is a plus.
• Proven project management skills are a plus
• Self-driven and entrepreneurial attitude – you derive energy from taking ownership and can effectively deal with ambiguity. Able to think ahead and make plans in an organized manner.
• Good written and verbal communication skills in English.