Programme Director – Semiconductor Start-up

Intellectual Capital Resources Ltd; Noord-Brabant; Presencial; EUR 120.000 - 180.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

ESOP

Relocation assistance

30 days holiday

Descripción de la vacante

Intellectual Capital Resources Ltd is seeking a hands-on semiconductor program leader to own the integrated delivery of an AI compute platform, from product definition through tape-out, bring-up, packaging and launch readiness. You will coordinate silicon, SiP, boards, firmware and software with external partners and lead readiness reviews.

You will bring experience in ASIC/AI accelerator programs, strong dependency and risk management, and the ability to navigate ambiguity in a fast-scaling

Formación

• Experience delivering silicon tape-out and bring-up to productisation.
• Hands-on SiP / advanced packaging program experience.
• Background in ASIC/AI accelerator, HPC, data-centre hardware.
• Strong understanding of RTL, verification, physical design, IP and foundry.
• Experience managing external engineering, manufacturing and supply-chain partners.
• Proven program controls including planning, dependencies and gate reviews.

Responsabilidades

• Own integrated program baseline: scope, schedule, cost, resources, risks and decisions.
• Lead silicon tape-out critical path and sign-off, with evidence and foundry commitments.
• Deliver SiP and advanced packaging integrated with silicon, boards, firmware and software.
• Coordinate external partners across design, memory, OSAT, packaging, test and IP vendors.
• Conduct readiness reviews with exit criteria, not mere status reports.
• Identify dependencies early and plan recovery when baselines shift.
• Make trade-offs for roadmap, capacity and risk; coach program managers.

Conocimientos

Tape-out ownership

SiP & packaging

ASIC / AI accelerator background

Semiconductor dependencies

External partner management

Program controls

Educación

Engineering degree

Descripción del empleo

A fast-growing deep-tech scale-up building a new AI compute platform from the ground up. Its proprietary processor architecture brings together custom silicon, stacked memory, advanced packaging, boards, firmware, system software and complete datacentre systems. This is a rare chance to lead delivery of next-generation AI hardware while the organisation, and the way it works, is still being shaped. This is not a PMO or reporting role. You'll be a hands-on semiconductor program leader who takes ownership of the integrated delivery of an AI compute platform, from product definition and architecture through tape-out, bring-up, package and system integration, software enablement, qualification and launch readiness.

What you'll own

• One integrated program baseline: scope, schedule, cost, resources, risks, decisions and external dependencies
• The silicon and tape-out critical path: RTL and verification readiness, design freeze, timing and power closure, sign-off evidence, mask release and foundry commitments
• System-in-Package (SiP) and advanced packaging delivery, integrated with silicon, boards, firmware and software
• Coordination of external partners, including physical design, foundry, memory, OSAT, packaging, test and IP vendors, holding owners to account at every interface
• Evidence-based readiness reviews with clear exit criteria, not status reporting
• Early identification of critical dependencies and recovery planning when things move off baseline
• Clear trade-offs and decisions for executive review, covering roadmap, investment, capacity and risk
• Building lean, practical Program Delivery ways of working as the business scales, and coaching program managers

What you'll bring

• Personal ownership of at least one successful silicon tape-out, ideally through bring-up, qualification and productisation
• Hands-on experience of SiP / advanced packaging programs
• A background in complex ASIC, AI accelerator, HPC, datacentre or similar deep-tech hardware programs
• Strong understanding of semiconductor dependencies: architecture, RTL, verification, physical design, IP, PDKs, foundry, packaging and test
• Experience managing external engineering, manufacturing and supply-chain partners
• Strong program controls: integrated planning, dependency and risk management, change control and gate reviewsThe confidence to influence without hierarchy and challenge plans constructively
• Comfort with ambiguity, limited process and fast-changing priorities in a scale-up
• A technical or engineering degree, or equivalent depth from industry experience

Working pattern and benefits

• Full-time and on-site in the Netherlands. Relocation to the Netherlands is required.
• 30 days' holiday plus Dutch holiday allowance
• An attractive employee share option scheme (ESOP)
• Immediate or near-term start preferred