Programme Director

IC Resources; Eindhoven; On-site; EUR 120,000 - 180,000; Full time

Benefits offered by this job

ESOP

Relocation to Netherlands

30 days holiday + Dutch holiday allot.

Job summary

IC Resources leads a fast-growing deep-tech initiative building a new AI compute platform in the Netherlands. This role is a hands-on program leader responsible for integrated delivery from product definition through tape-out, bring-up, packaging and launch readiness.

You will own the silicon tape-out critical path, manage external partners and drive readiness reviews with clear exit criteria, while coaching program managers as the business scales.

Qualifications

• Own at least one silicon tape-out through bring-up and production.
• Hands-on SiP / advanced packaging program experience.
• Background in ASIC/AI accelerator/HPC or data-centre hardware.

Responsibilities

• Define integrated program baseline: scope, schedule, cost, resources, risks, decisions.
• Manage silicon tape-out and timing/power closure with foundry commitments.
• Deliver SiP with silicon, boards, firmware and software.
• Coordinate external partners and hold owners to account.
• Run readiness reviews with exit criteria, not status reporting.
• Identify dependencies early and plan recovery when off baseline.
• Present trade-offs for executive review on roadmap and capacity.
• Build lean program delivery practices and coach PMs.

Skills

Silicon tape-out

SiP / advanced packaging

ASIC / AI accelerator

RTL verification

Physical design

Foundry/vendor management

Program controls

Stakeholder influence

Ambiguity tolerance

Engineering degree

Education

Engineering degree

Job description

A fast-growing deep-tech scale-up building a new AI compute platform from the ground up. Its proprietary processor architecture brings together custom silicon, stacked memory, advanced packaging, boards, firmware, system software and complete datacentre systems. This is a rare chance to lead delivery of next-generation AI hardware while the organisation, and the way it works, is still being shaped.

This is not a PMO or reporting role. You'll be a hands-on semiconductor program leader who takes ownership of the integrated delivery of an AI compute platform, from product definition and architecture through tape-out, bring-up, package and system integration, software enablement, qualification and launch readiness.

What you'll own

• One integrated program baseline: scope, schedule, cost, resources, risks, decisions and external dependencies
• The silicon and tape-out critical path: RTL and verification readiness, design freeze, timing and power closure, sign-off evidence, mask release and foundry commitments
• System-in-Package (SiP) and advanced packaging delivery, integrated with silicon, boards, firmware and software
• Coordination of external partners, including physical design, foundry, memory, OSAT, packaging, test and IP vendors, holding owners to account at every interface
• Evidence-based readiness reviews with clear exit criteria, not status reporting
• Early identification of critical dependencies and recovery planning when things move off baseline
• Clear trade-offs and decisions for executive review, covering roadmap, investment, capacity and risk
• Building lean, practical Program Delivery ways of working as the business scales, and coaching program managers

What you'll bring

• Personal ownership of at least one successful silicon tape-out, ideally through bring-up, qualification and productisation
• Hands-on experience of SiP / advanced packaging programs
• A background in complex ASIC, AI accelerator, HPC, datacentre or similar deep-tech hardware programs
• Strong understanding of semiconductor dependencies: architecture, RTL, verification, physical design, IP, PDKs, foundry, packaging and test
• Experience managing external engineering, manufacturing and supply-chain partners
• Strong program controls: integrated planning, dependency and risk management, change control and gate reviews
• The confidence to influence without hierarchy and challenge plans constructively
• Comfort with ambiguity, limited process and fast-changing priorities in a scale-up
• A technical or engineering degree, or equivalent depth from industry experience

Working pattern and benefits

• Full-time and on-site in the Netherlands. Relocation to the Netherlands is required.
• 30 days' holiday plus Dutch holiday allowance
• An attractive employee share option scheme (ESOP)
• Immediate or near-term start preferred