Photonics Packaging Lead: III-V to Silicon Laser

imec the Netherlands; Eindhoven; On-site; EUR 75,000 - 95,000; Full time

Benefits offered by this job

Pension plan

Flexible working hours

Relocation support

Training opportunities

Job summary

imec The Netherlands in Eindhoven is seeking a Photonics Advanced Packaging Engineer to identify and enable photonic packaging paths for integrated photonics across research projects such as Laser, LiDAR, and Datacom. You will lead laser integration packaging, manage workflows with internal and external partners, and develop next-generation packaging technologies.

The role emphasizes ownership, collaboration, and delivering outcomes in an international environment.

Qualifications

• MSc with 4+ years of experience or PhD in EE, physics, photonics, ME or equivalent.
• Hands-on experience with semiconductor laser packaging, including fiber coupling, butt coupling, and laser assembly techniques.
• Good understanding of laser-related packaging processes.
• Solid understanding of electrical packaging and opto-electronic integration.
• Experience with packaging design and mechanical CAD tools (SolidWorks 3D) is a strong advantage.
• Expertise of high-speed interconnects is a strong plus.
• Experience with the design, simulation, and characterization of photonic integrated circuits (PICs) and opto-electronic components—including lasers, photodetectors, modulators, and spot-size converters—is an advantage. Familiarity with photonic simulation tools such as FDTD is a plus.
• Proven project management skills are a plus
• Self-driven and entrepreneurial attitude – you derive energy from taking ownership and can effectively deal with ambiguity. Able to think ahead and make plans in an organized manner.
• Good written and verbal communication skills in English.

Responsibilities

• Lead the development of laser integration and packaging solutions for integrated photonics, with a strong focus on III–V to Silicon (Silicon Nitride) packaging strategies.
• Own and manage established packaging workflows in close collaboration with internal teams and external partners
• Build new packaging paths for operational excellence and new demands.
• Establish and improve design-for-packaging (DfP) guidelines covering optical, electrical, and thermal aspects.
• Develop next-generation packaging and integration technologies for emerging applications.
• Define and evaluate packaging architecture options, including trade-offs in performance, cost, and manufacturability.
• Take the ownership of planning, scheduling, and execution of packaging campaigns as well as performance and yield analysis.
• Demonstration and validation of packaged chips in a lab environment.
• Share insights and experiences with the team and contribute to the development and maturity of packaging.
• Prepare technical notes and documentation for internal and external customers. Optionally, file patents or publish your work.

Skills

Semiconductor laser packaging

Fiber coupling

Butt coupling

Laser assembly

Electrical packaging

Opto-electronic integration

On-chip laser coupling

Photonic integration

Project management

Education

MSc or PhD in EE/Physics/Photonics/ME

Tools

SolidWorks 3D

FDTD

Job description

imec The Netherlands in Eindhoven is seeking a Photonics Advanced Packaging Engineer to identify and enable photonic packaging paths for integrated photonics across research projects such as Laser, LiDAR, and Datacom. You will lead laser integration packaging, manage workflows with internal and external partners, and develop next-generation packaging technologies.

The role emphasizes ownership, collaboration, and delivering outcomes in an international environment.